US2024040703A1PendingUtilityA1
Methods of creating exposed cavities in molded electronic devices
Est. expirySep 26, 2039(~13.2 yrs left)· nominal 20-yr term from priority
H10W 74/016H10P 72/0612H10P 72/0428H10P 72/0438H05K 3/0044H05K 3/0026H05K 3/284H05K 2203/025H05K 2203/1327H05K 2203/1316H05K 2203/0228H05K 2203/308H05K 2201/10151H05K 2201/10257H05K 2201/0305H05K 5/065
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Claims
Abstract
Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.
Claims
exact text as granted — not AI-modified1 . A method comprising: receiving at least one electronic device including a sensor or an emitter; placing a cover over the sensor or emitter; placing the electronic device, including the cover, into a transfer mold system; encapsulating the electronic device with charge material; and removing a portion of the charge material and the cover to expose the sensor or emitter to an environment.
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