Inventor · disambiguated record
David Geiger
Also filed as: GEIGER DAVID · GEIGER DAVID S
23 granted patents·4 pending applications·90 citations·filing 1980–2023
93Inventor score
Top patents by PatentIndex Score
27 records- 0192US10231333B1Copper interconnect for PTH components assemblyFLEXTRONICS AP LLC·Filed 2014·Granted Mar 12, 2019·13 cites·13 claims
- 0288US11039531B1System and method for in-molded electronic unit using stretchable substrates to create deep drawn cavities and featuresFLEX LTD·Filed 2018·Granted Jun 15, 2021·5 cites·24 claims
- 0388US9661756B1Nano-copper pillar interconnects and methods thereofFLEXTRONICS AP LLC·Filed 2014·Granted May 23, 2017·7 cites·15 claims
- 0485US9593939B1Glue thickness inspection (GTI)FLEXTRONICS AP LLC·Filed 2014·Granted Mar 14, 2017·17 cites·14 claims
- 0584US9659359B1Method of and device for quality control process optimizationFLEXTRONICS AP LLC·Filed 2015·Granted May 23, 2017·5 cites·18 claims
- 0678US2023086271A1Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive componentsFLEX LTD·Filed 2022·Application pending·0 cites
- 0776US8328077B1PV cell mass reflowWILLIE DENNIS·Filed 2011·Granted Dec 11, 2012·5 cites·2 claims
- 0874US11723151B2Methods of creating exposed cavities in molded electronic devicesFLEX LTD·Filed 2022·Granted Aug 8, 2023·0 cites·20 claims
- 0973US2024040703A1Methods of creating exposed cavities in molded electronic devicesFLEX LTD·Filed 2023·Application pending·0 cites
- 1072US11516924B2Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive componentsFLEX LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 1170US7434359B2Constructing geodesic domes with panelsGEIGER DAVID S·Filed 2004·Granted Oct 14, 2008·21 cites·21 claims
- 1270US2023068784A1Adjustable carrier with changeable core and methods for manufacturing printed circuit board assembliesFLEX LTD·Filed 2022·Application pending·0 cites
- 1368US9699902B1Printed circuit board made through sintering copper nano-particlesFLEXTRONICS AP LLC·Filed 2014·Granted Jul 4, 2017·1 cites·30 claims
- 1467US11850684B2Wave solder pallets for optimal solder flow and methods of manufacturingFLEX LTD·Filed 2020·Granted Dec 26, 2023·0 cites·5 claims
- 1563US11304302B2Methods of creating exposed cavities in molded electronic devicesFLEX LTD·Filed 2019·Granted Apr 12, 2022·0 cites·15 claims
- 1663US10828828B2Method of manufacturing a partFLEX LTD·Filed 2017·Granted Nov 10, 2020·0 cites·14 claims
- 1762US10827626B2Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive componentsFLEX LTD·Filed 2017·Granted Nov 3, 2020·0 cites·4 claims
- 1862US10737344B2Method of manufacturing a wave solder palletFLEX LTD·Filed 2017·Granted Aug 11, 2020·0 cites·8 claims
- 1962US9566764B1Fast cure conductive epoxy attach methodology for high speed automated processesFLEXTRONICS AP LLC·Filed 2014·Granted Feb 14, 2017·0 cites·19 claims
- 2062US6996942B2Constructing geodesic domesGEIGER DAVID S·Filed 2003·Granted Feb 14, 2006·12 cites·45 claims
- 2161US9521738B1Graphite sheet to protect SMT components from thermal exposureFLEXTRONICS AP LLC·Filed 2014·Granted Dec 13, 2016·1 cites·23 claims
- 2261US2020180218A1Printed parts with interlayers and methods of manufacturing the sameFLEX LTD·Filed 2020·Application pending·0 cites
- 2357US9801277B1Bellows interconnectFLEXTRONICS AP LLC·Filed 2014·Granted Oct 24, 2017·0 cites·20 claims
- 2453US9609738B1Graphite sheet to redirect SMT components during thermal exposureFLEXTRONICS AP LLC·Filed 2014·Granted Mar 28, 2017·0 cites·19 claims
- 2553US9397065B1Fixture design for pre-attachment package on package component assemblyFLEXTRONICS AP LLC·Filed 2014·Granted Jul 19, 2016·0 cites·19 claims
- 2648US11425848B2Adjustable carrier with changeable coreFLEX LTD·Filed 2017·Granted Aug 23, 2022·0 cites·13 claims
- 2730US4345410AConstruction methodGEIGER DAVID·Filed 1980·Granted Aug 24, 1982·3 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →