Adjustable carrier with changeable core and methods for manufacturing printed circuit board assemblies

Abstract

A carrier assembly configured to facilitate manufacture of a printed circuit board assembly includes a bottom frame defining a generally rectangular configuration and having a length and a width. The bottom frame is adjustable to vary at least one of the length or the width thereof. The assembly further includes a core releasably positionable on the bottom frame and configured to support a circuit board thereon. A carrier assembly system includes the bottom frame and a plurality of cores. Methods of manufacturing printed circuit board assemblies utilizing carrier assemblies are also provided.

What is claimed is: 
     
         1 . A carrier assembly configured to facilitate manufacture of a printed circuit board assembly, the carrier assembly comprising:
 a bottom frame defining a generally rectangular configuration and having a length and a width, the bottom frame adjustable to vary at least one of the length or the width thereof; and   a core releasably positionable on the bottom frame, the core configured to support a circuit board thereon.   
     
     
         2 . The carrier assembly according to  claim 1 , further comprising a top frame defining a generally rectangular configuration and having a length and a width, the top frame adjustable to vary at least one of the length or the width thereof, the top frame releasably engagable with the bottom frame to retain the core therebetween. 
     
     
         3 . The carrier assembly according to  claim 2 , further comprising at least one clamp configured to releasably engage the top and bottom frames with one another. 
     
     
         4 . The carrier assembly according to  claim 1 , wherein the core is customized to the circuit board configured to be supported thereon. 
     
     
         5 . The carrier assembly according to  claim 4 , wherein the core is formed from a high temperature grade plastic via 3D printing. 
     
     
         6 . The carrier assembly according to  claim 1 , wherein the bottom frame is formed from a metal. 
     
     
         7 . The carrier assembly according to  claim 1 , wherein the bottom frame is reusable and wherein the carrier is disposable. 
     
     
         8 . The carrier assembly according to  claim 1 , wherein the bottom frame is adjustable to vary each of the length and the width thereof. 
     
     
         9 . The carrier assembly according to  claim 1 , wherein the bottom frame is configured to retain the core in two axial directions, and wherein the core is configured to retain the circuit board in two axial dimensions. 
     
     
         10 . A carrier assembly system configured to facilitate manufacture of a printed circuit board assembly, the carrier assembly system comprising:
 a bottom frame defining a generally rectangular configuration and having a length and a width, the bottom frame adjustable to vary at least one of the length or the width thereof; and   a plurality of cores, each core defining a different configuration and configured for releasable positioning on the bottom frame, each core configured to support a different circuit board thereon.   
     
     
         11 . The carrier assembly system according to  claim 10 , wherein the at least one of the length or the width of the bottom frame is adjusted to accommodate at least two different cores of the plurality of cores. 
     
     
         12 . The carrier assembly system according to  claim 10 , further comprising a top frame defining a generally rectangular configuration and having a length and a width, the top frame adjustable to vary at least one of the length or the width thereof, the top frame releasably engagable with the bottom frame to retain one of the cores of the plurality of cores therebetween. 
     
     
         13 . The carrier assembly system according to  claim 12 , further comprising at least one clamp configured to releasably engage the top and bottom frames with one another. 
     
     
         14 . The carrier assembly system according to  claim 10 , wherein each core is formed from a high temperature grade plastic via 3D printing. 
     
     
         15 . The carrier assembly system according to  claim 10 , wherein the bottom frame is formed from a metal. 
     
     
         16 . The carrier assembly system according to  claim 10 , wherein the bottom frame is reusable and wherein the carrier is disposable. 
     
     
         17 . The carrier assembly system according to  claim 10 , wherein the bottom frame is adjustable to vary each of the length and the width thereof. 
     
     
         18 . A method of manufacturing a printed circuit board assembly, the method comprising:
 selecting a core based upon a configuration of a printed circuit board to be manufactured;   adjusting a bottom frame based upon the core selected;   seating the core on the bottom frame;   seating a circuit board of the printed circuit board to be manufactured on the core; and   moving the bottom frame through at least one assembly station.   
     
     
         19 . The method according to  claim 18 , wherein adjusting the bottom frame includes varying at least one of a length or a width of the bottom frame. 
     
     
         20 . The method according to  claim 18 , further comprising engaging a top frame on the bottom frame to retain the circuit board and the core therebetween.