Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components

Abstract

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

What is claimed is: 
     
         1 . A protective heat shield for a printed circuit board assembly, comprising:
 a body having an outer surface and an inner surface, the inner surface defining a cavity for receipt of a thermally-sensitive component having a maximum temperature threshold, wherein the body conforms to a shape of the thermally-sensitive component such that the body covers the thermally-sensitive component but exposes non-thermally sensitive components of a plurality of components disposed on a printed circuit board assembly during exposure to a high temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component.   
     
     
         2 . The protective heat shield according to  claim 1 , wherein the body is selectively removable from the thermally-sensitive component. 
     
     
         3 . The protective heat shield according to  claim 1 , wherein the body is formed from a high temperature grade plastic. 
     
     
         4 . The protective heat shield according to  claim 3 , wherein the body is 3D printed. 
     
     
         5 . The protective heat shield according to  claim 1 , wherein the outer surface of the body includes a pick-up area, the pick-up area engageable with a SMT machine. 
     
     
         6 . The protective heat shield according to  claim 1 , wherein an engagement finger is disposed on the inner surface of the body, the engagement finger configured to releasably engage a portion of the thermally-sensitive component. 
     
     
         7 . The protective heat shield according to  claim 6 , wherein the engagement finger is a tab extending from the inner surface of the body. 
     
     
         8 . The protective heat shield according to  claim 6 , wherein the engagement finger is a hook extending from the inner surface of the body. 
     
     
         9 . The protective heat shield according to  claim 1 , wherein the body defines a semi-disc shaped configuration. 
     
     
         10 . The protective heat shield according to  claim 1 , wherein the body conforms to a portion of the thermally-sensitive component, wherein a remaining portion of the thermally-sensitive component is exposed to the high temperature environment. 
     
     
         11 . A protective heat shield for a printed circuit board assembly, comprising:
 a 3D printed body defining a cavity for receipt of a thermally-sensitive component having a maximum temperature threshold, wherein the body conforms to a portion of a shape of the thermally-sensitive component such that the body covers the portion of the thermally-sensitive component but exposes the remaining portion of the thermally-sensitive component and non-thermally sensitive components of a plurality of components disposed on a printed circuit board assembly during exposure to a high temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component.   
     
     
         12 . The protective heat shield according to  claim 11 , wherein the body is selectively removable from the thermally-sensitive component. 
     
     
         13 . The protective heat shield according to  claim 11 , wherein the body is formed from a high temperature grade plastic. 
     
     
         14 . The protective heat shield according to  11 , wherein an outer surface of the body defines a pick-up area, the pick-up area engageable with a SMT machine. 
     
     
         15 . The protective heat shield according to  claim 11 , wherein an engagement finger is disposed on an inner surface of the body, the engagement finger configured to releasably engage the thermally-sensitive component. 
     
     
         16 . A protective heat shield for a printed circuit board assembly, comprising:
 a body defining a cavity for receipt of a thermally-sensitive component having a maximum temperature threshold, wherein the body conforms to a shape of the thermally-sensitive component but exposes non-thermally sensitive components of a plurality of components disposed on a printed circuit board assembly during exposure to a high temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component,   wherein an engagement finger is disposed on an inner surface of the body, the engagement finger extending into the cavity and configured to releasably engage the thermally-sensitive component.   
     
     
         17 . The protective heat shield according to  claim 16 , wherein the engagement finger is a tab configured for selective receipt within a slot defined on a portion of the thermally-sensitive component. 
     
     
         18 . The protective heat shield according to  claim 16 , wherein the engagement finger is a hook configured to selective receipt within a slot defined on a portion of the thermally-sensitive component. 
     
     
         19 . The protective heat shield according to  claim 16 , wherein the body conforms to a portion of the thermally-sensitive component, wherein a remaining portion of the thermally-sensitive component is exposed to the high temperature environment. 
     
     
         20 . The protective heat shield according to  claim 16 , wherein the body includes a pick-up area, the pick-up area engageable with a SMT machine.