Inventor · disambiguated record
Dongkai Shangguan
Also filed as: SHANGGUAN DONGKAI
35 granted patents·7 pending applications·795 citations·filing 1994–2023
97Inventor score
Files withFLEX LTD16FORD MOTOR CO11VISTEON GLOBAL TECH INC4FLEXTRONICS AP LLC2FLEXTRONICS INT USA INC2
Top patents by PatentIndex Score
42 records- 0195US7796187B2Wafer based camera module and method of manufactureFLEXTRONICS AP LLC·Filed 2005·Granted Sep 14, 2010·35 cites·46 claims
- 0295US6250541B1Method of forming interconnections on electronic modulesVISTEON GLOBAL TECH INC·Filed 2000·Granted Jun 26, 2001·100 cites·2 claims
- 0393US5894054AAluminum components coated with zinc-antimony alloy for manufacturing assemblies by CAB brazingFORD MOTOR CO·Filed 1997·Granted Apr 13, 1999·69 cites·12 claims
- 0492US10896877B1System in package with double side mounted boardFLEX LTD·Filed 2018·Granted Jan 19, 2021·9 cites·11 claims
- 0592US5863493ALead-free solder compositionsFORD MOTOR CO·Filed 1996·Granted Jan 26, 1999·83 cites·8 claims
- 0689US8092102B2Camera module with premolded lens housing and method of manufactureSHANGGUAN DONGKAI·Filed 2006·Granted Jan 10, 2012·22 cites·11 claims
- 0789US5833921ALead-free, low-temperature solder compositionsFORD MOTOR CO·Filed 1997·Granted Nov 10, 1998·65 cites·1 claims
- 0889US5429689ALead-free solder alloysFORD MOTOR CO·Filed 1994·Granted Jul 4, 1995·39 cites·17 claims
- 0988US10653010B1Connection of multilayer printed conductive ink through filled microviasFLEX LTD·Filed 2019·Granted May 12, 2020·5 cites·15 claims
- 1087US7684689B2External adjustment mechanism for a camera lens and electronic imagerFLEXTRONICS INT USA INC·Filed 2005·Granted Mar 23, 2010·14 cites·125 claims
- 1187US6082610AMethod of forming interconnections on electronic modulesFORD MOTOR CO·Filed 1997·Granted Jul 4, 2000·72 cites·12 claims
- 1284US5928404AElectrical solder and method of manufacturingFORD MOTOR CO·Filed 1997·Granted Jul 27, 1999·49 cites·6 claims
- 1383US11682603B2Control of thermal interface material in multi-chip packageFLEX LTD·Filed 2021·Granted Jun 20, 2023·1 cites·20 claims
- 1481US6027575AMetallic adhesive for forming electronic interconnects at low temperaturesFORD MOTOR CO·Filed 1997·Granted Feb 22, 2000·47 cites·6 claims
- 1580US6011313AFlip chip interconnections on electronic modulesFORD MOTOR CO·Filed 1999·Granted Jan 4, 2000·44 cites·1 claims
- 1679US11270974B2Embedded copper structure for microelectronics packageFLEX LTD·Filed 2019·Granted Mar 8, 2022·2 cites·19 claims
- 1778US9419032B2Wafer level camera module with molded housing and method of manufacturingSINGH HARPUNEET·Filed 2009·Granted Aug 16, 2016·5 cites·25 claims
- 1874US11723151B2Methods of creating exposed cavities in molded electronic devicesFLEX LTD·Filed 2022·Granted Aug 8, 2023·0 cites·20 claims
- 1973US7872686B2Integrated lens and chip assembly for a digital cameraFLEXTRONICS INT USA INC·Filed 2004·Granted Jan 18, 2011·10 cites·74 claims
- 2073US5996222ASoldering process with minimal thermal impact on substrateFORD MOTOR CO·Filed 1998·Granted Dec 7, 1999·36 cites·12 claims
- 2173US5755896ALow temperature lead-free solder compositionsFORD MOTOR CO·Filed 1996·Granted May 26, 1998·32 cites·2 claims
- 2273US2024040703A1Methods of creating exposed cavities in molded electronic devicesFLEX LTD·Filed 2023·Application pending·0 cites
- 2370US6360939B1Lead-free electrical solder and method of manufacturingVISTEON GLOBAL TECH INC·Filed 1998·Granted Mar 26, 2002·25 cites·11 claims
- 2467US11470717B2Stress relief encapsulation for flexible hybrid electronicsFLEX LTD·Filed 2021·Granted Oct 11, 2022·0 cites·11 claims
- 2567US8477239B2Integrated lens and chip assembly for a digital cameraKALE VIDYADHAR SITARAM·Filed 2011·Granted Jul 2, 2013·2 cites·32 claims
- 2663US11304302B2Methods of creating exposed cavities in molded electronic devicesFLEX LTD·Filed 2019·Granted Apr 12, 2022·0 cites·15 claims
- 2763US2022238482A1Embedded copper structure for microelectronics packageFLEX LTD·Filed 2022·Application pending·0 cites
- 2861US5871690ALow-temperature solder compositionsFORD MOTOR CO·Filed 1997·Granted Feb 16, 1999·19 cites·6 claims
- 2959US6476332B1Conductor systems for thick film electronic circuitsVISTEON GLOBAL TECH INC·Filed 2001·Granted Nov 5, 2002·8 cites·19 claims
- 3058US11064613B2Electronics encapsulation through hotmelt laminationFLEX LTD·Filed 2019·Granted Jul 13, 2021·0 cites·16 claims
- 3158US10999926B2Stress relief encapsulation for flexible hybrid electronicsFLEX LTD·Filed 2019·Granted May 4, 2021·0 cites·9 claims
- 3256US11493414B2Testing system for flexible sample in electronics having a retractable holder configured to conform a sample by a mandrelFLEX LTD·Filed 2020·Granted Nov 8, 2022·0 cites·13 claims
- 3356US2014047711A1Method for mounting protective covers over image capture devices and devices manufactured therebyFLEXTRONICS AP LLC·Filed 2013·Application pending·0 cites
- 3455US12156356B2Electronic encapsulation through stencil printingFLEX LTD·Filed 2021·Granted Nov 26, 2024·0 cites·5 claims
- 3554US12243850B2Devices, systems, and methods for stacked die packagesFLEX LTD·Filed 2021·Granted Mar 4, 2025·0 cites·20 claims
- 3652US2007236591A1Method for mounting protective covers over image capture devices and devices manufactured therebyTAM SAMUEL W·Filed 2006·Application pending·0 cites
- 3748US11289393B2Methods, devices, and systems for electronic device molding and encapsulationFLEX LTD·Filed 2020·Granted Mar 29, 2022·0 cites·20 claims
- 3846US6416597B1Solder composition and a method for making the sameVISTEON GLOBAL TECH INC·Filed 2000·Granted Jul 9, 2002·2 cites·14 claims
- 3946US2021076496A1Solder electronic components to printed conductive inkFLEX LTD·Filed 2019·Application pending·0 cites
- 4044US2008170141A1Folded package camera module and method of manufactureTAM SAMUEL WAISING·Filed 2007·Application pending·0 cites
- 4144US2011299848A1Camera Module with Premolded Lens Housing and Method of ManufactureSHANGGUAN DONGKAI·Filed 2011·Application pending·0 cites
- 4237US9773684B2Method of manufacturing fan out wafer level packageNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2015·Granted Sep 26, 2017·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →