Inventor · disambiguated record
Chun-Wei Yu
Also filed as: YU CHUN · YU CHUN-WEI
28 granted patents·10 pending applications·28 citations·filing 2005–2025
93Inventor score
Files withUNITED MICROELECTRONICS CORP30ELAND BLOCKCHAIN FINTECH INC3HUAWEI TECH CO LTD2CHUNGHWA PICTURE TUBES LTD1FULLHOPE BIOMEDICAL CO LTD1
Top patents by PatentIndex Score
38 records- 0189US10332981B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 25, 2019·5 cites·7 claims
- 0289US9646889B1Method of removing a hard mask layer on a gate structure while forming a protective layer on the surface of a substrateUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 9, 2017·5 cites·11 claims
- 0384US10079143B2Method of forming semiconductor device having wick structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 18, 2018·3 cites·10 claims
- 0483US11049971B2Semiconductor device having epitaxial structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 29, 2021·2 cites·13 claims
- 0582US12317547B2Method of fabricating semiconductor device having epitaxial structureUNITED MICROELECTRONICS CORP·Filed 2023·Granted May 27, 2025·0 cites·12 claims
- 0682US2025254931A1Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0782US2025261412A1Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0881US9960084B1Method for forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 1, 2018·3 cites·11 claims
- 0980US10446667B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 15, 2019·2 cites·11 claims
- 1078US10796943B2Manufacturing method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 6, 2020·2 cites·12 claims
- 1178US9728397B1Semiconductor device having the insulating layers cover a bottom portion of the fin shaped structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 8, 2017·2 cites·7 claims
- 1276US9793105B1Fabricating method of fin field effect transistor (FinFET)UNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 17, 2017·2 cites·20 claims
- 1375US10366991B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 30, 2019·2 cites·22 claims
- 1475US2025072060A1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1573US11735661B2Method of fabricating semiconductor device having epitaxial structureUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 22, 2023·0 cites·6 claims
- 1668US12402367B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Aug 26, 2025·0 cites·14 claims
- 1760US10651174B2FinFET structure and fabricating method of gate structureUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 12, 2020·0 cites·5 claims
- 1855US10505041B2Semiconductor device having epitaxial layer with planar surface and protrusionsUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 10, 2019·0 cites·7 claims
- 1954US11999968B2Modified T cells, pharmaceutical composition, manufacturing method thereof, and method of using the sameFULLHOPE BIOMEDICAL CO LTD·Filed 2021·Granted Jun 4, 2024·0 cites·9 claims
- 2053US10700202B2Semiconductor device and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 30, 2020·0 cites·20 claims
- 2153US2025089334A1semiconductor structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2250US10340268B2FinFET structure and fabricating method of gate structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jul 2, 2019·0 cites·6 claims
- 2349US10622481B2Method of rounding corners of a finUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 14, 2020·0 cites·9 claims
- 2448US10332750B2Method for fabricating semiconductor device with strained silicon structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jun 25, 2019·0 cites·11 claims
- 2546US10460925B2Method for processing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 29, 2019·0 cites·20 claims
- 2645US10559655B1Semiconductor device and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Feb 11, 2020·0 cites·18 claims
- 2744US9871113B2Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jan 16, 2018·0 cites·16 claims
- 2843US10332741B2Method for post chemical mechanical polishing cleanUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jun 25, 2019·0 cites·3 claims
- 2941US9741572B1Method of forming oxide layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 22, 2017·0 cites·12 claims
- 3041US9514993B2Method for manufacturing semiconductor devices comprising epitaxial layersUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 6, 2016·0 cites·8 claims
- 3141US2006146262A1Method and the plasma display panel with an improvement of overflow effect of anisotropic conductive adhesive filmCHUNGHWA PICTURE TUBES LTD·Filed 2005·Application pending·0 cites
- 3239US2020371662A1Report Point Output Control Method and ApparatusHUAWEI TECH CO LTD·Filed 2018·Application pending·0 cites
- 3338US11216116B2Control method and terminalHUAWEI TECH CO LTD·Filed 2018·Granted Jan 4, 2022·0 cites·18 claims
- 3438US9966266B2Apparatus for semiconductor wafer treatment and semiconductor wafer treatmentUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 8, 2018·0 cites·10 claims
- 3537US2020250665A1Blockchain-based electronic transaction system free of sales platform and method thereofELAND BLOCKCHAIN FINTECH INC·Filed 2018·Application pending·0 cites
- 3636US2020051071A1Electronic transaction system and method using a blockchain to store transaction recordsELAND BLOCKCHAIN FINTECH INC·Filed 2018·Application pending·0 cites
- 3736US2021248603A1Blockchain-based transaction processing method and apparatusELAND BLOCKCHAIN FINTECH INC·Filed 2021·Application pending·0 cites
- 3832US2008057640A1Method for fabricating first electrode of capacitorPROMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chun-Wei Yu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →