Inventor · disambiguated record
Cheng-Fu Yu
Also filed as: YU CHENG-FU
3 granted patents·5 pending applications·2 citations·filing 2005–2025
53Inventor score
Top patents by PatentIndex Score
8 records- 0182US11612965B2Method of forming package structureINTEGRATED SILICON SOLUTION INC·Filed 2020·Granted Mar 28, 2023·2 cites·9 claims
- 0266US11951571B2Method of forming package structureINTEGRATED SILICON SOLUTION INC·Filed 2023·Granted Apr 9, 2024·0 cites·6 claims
- 0358US2025266328A1Package structureINTEGRATED SILICON SOLUTION INC·Filed 2025·Application pending·0 cites
- 0450US2022246501A1Package structureINTEGRATED SILICON SOLUTION INC·Filed 2022·Application pending·0 cites
- 0547US2025364378A1Leadframe and package structureCHINGIS TECH CORPORATION·Filed 2024·Application pending·0 cites
- 0645US2025253214A1Package structure and method of forming thereofCHINGIS TECH CORPORATION·Filed 2024·Application pending·0 cites
- 0735US2021305136A1Package structureINTEGRATED SILICON SOLUTION INC·Filed 2020·Application pending·0 cites
- 0831US8603643B2Electronic component having tin rich deposit layer and the process for depositing the sameYU CHENG-FU·Filed 2005·Granted Dec 10, 2013·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →