Inventor · disambiguated record
Chia-Chieh Yu
Also filed as: YU CHIA-CHIEH
11 granted patents·1 pending application·182 citations·filing 1996–2001
91Inventor score
Top patents by PatentIndex Score
12 records- 0176US6258713B1Method for forming dual damascene structureUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jul 10, 2001·53 cites·16 claims
- 0272US6063207ASurface treatment for bonding padUNITED SEMICONDUCTOR CORP·Filed 1999·Granted May 16, 2000·48 cites·14 claims
- 0359US6475707B2Method of reworking photoresist layerUNITED MICROELECTRONICS CORP·Filed 2000·Granted Nov 5, 2002·7 cites·6 claims
- 0457US6133143AMethod of manufacturing interconnectUNITED SEMICONDUCTOR CORP·Filed 1999·Granted Oct 17, 2000·22 cites·11 claims
- 0547US6197678B1Damascene processUNITED SEMICONDUCTOR CORP·Filed 1999·Granted Mar 6, 2001·13 cites·24 claims
- 0643US6197673B1Method of fabricating passivation of gate electrodeUNITED SEMICONDUCTOR CORP·Filed 1999·Granted Mar 6, 2001·9 cites·14 claims
- 0740US6107205AMethod for removing photoresistUNITED SEMICONDUCTOR CORP·Filed 1999·Granted Aug 22, 2000·8 cites·11 claims
- 0838US6143652AMethod for forming metallic layer using inspected maskUNITED SEMICONDUCTOR CORP·Filed 1998·Granted Nov 7, 2000·7 cites·22 claims
- 0938US6033588AMethod for improving differential etching rate of a metallic layerUNITED SEMICONDUCTOR CORP·Filed 1997·Granted Mar 7, 2000·7 cites·23 claims
- 1036US5882537AMetallic precipitate monitoring methodUNITED MICROELECTRONIC CORP·Filed 1996·Granted Mar 16, 1999·6 cites·10 claims
- 1134US2002096490A1Photolithographic and etching methodFiled 2001·Application pending·0 cites
- 1231US6274493B1Method for forming a viaUNITED MICROELECTRONICS CORP·Filed 1999·Granted Aug 14, 2001·2 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →