Inventor · disambiguated record
Chan Min Yu
Also filed as: YU CHAN M · YU CHAN MIN
20 granted patents·1 pending application·1,184 citations·filing 1994–2010
97Inventor score
Top patents by PatentIndex Score
21 records- 0199US6611052B2Wafer level stackable semiconductor packageMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 26, 2003·261 cites·39 claims
- 0299US6582992B2Stackable semiconductor package and wafer level fabrication methodMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 24, 2003·283 cites·19 claims
- 0397US6727116B2Semiconductor devices including peripherally located bond pads, assemblies, packages, and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 27, 2004·149 cites·25 claims
- 0495US7358154B2Method for fabricating packaged dieMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 15, 2008·30 cites·24 claims
- 0594US7285850B2Support elements for semiconductor devices with peripherally located bond padsMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 23, 2007·26 cites·27 claims
- 0694US7115984B2Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 3, 2006·67 cites·10 claims
- 0794US6894386B2Apparatus and method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2002·Granted May 17, 2005·69 cites·30 claims
- 0893US6818977B2Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packagesMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 16, 2004·60 cites·43 claims
- 0991US6836009B2Packaged microelectronic componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 28, 2004·51 cites·53 claims
- 1084US7675169B2Apparatus and method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 9, 2010·9 cites·20 claims
- 1183US7195957B2Packaged microelectronic componentsMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 27, 2007·25 cites·6 claims
- 1279US5619067ASemiconductor device package side-by-side stacking and mounting systemTEXAS INSTRUMENTS INC·Filed 1994·Granted Apr 8, 1997·61 cites·26 claims
- 1377US8138617B2Apparatus and method for packaging circuitsPOO CHIA YONG·Filed 2004·Granted Mar 20, 2012·19 cites·15 claims
- 1475US7226809B2Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methodsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 5, 2007·15 cites·48 claims
- 1574US5663105ASemiconductor device package side-by-side stacking and mounting systemTEXAS INSTRUMENTS INC·Filed 1996·Granted Sep 2, 1997·45 cites·15 claims
- 1666US6836008B2Semiconductor packages with leadframe grid arrays and componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 28, 2004·10 cites·52 claims
- 1765US7170161B2In-process semiconductor packages with leadframe grid arraysMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 30, 2007·2 cites·20 claims
- 1859US8115306B2Apparatus and method for packaging circuitsPOO CHIA YONG·Filed 2010·Granted Feb 14, 2012·1 cites·20 claims
- 1951US2007120247A1Semiconductor packages having leadframe-based connection arraysYU CHAN M·Filed 2007·Application pending·0 cites
- 2046US6967127B2Methods for making semiconductor packages with leadframe grid arraysMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 22, 2005·1 cites·19 claims
- 2145US8637973B2Packaged microelectronic components with terminals exposed through encapsulantKOON ENG MEOW·Filed 2007·Granted Jan 28, 2014·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Chan Min Yu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →