Inventor · disambiguated record
Chengjie Zuo
Also filed as: ZUO CHENGJIE
108 granted patents·43 pending applications·506 citations·filing 2011–2022
99Inventor score
Files withQUALCOMM INC98ANHUI ANUKI TECH CO LTD19ZUO CHENGJIE11QUALCOMM MEMS TECHNOLOGIES INC6LO CHI SHUN5
Top patents by PatentIndex Score
151 records- 0198US9449753B2Varying thickness inductorQUALCOMM INC·Filed 2014·Granted Sep 20, 2016·33 cites·25 claims
- 0298US8816567B2Piezoelectric laterally vibrating resonator structure geometries for spurious frequency suppressionZUO CHENGJIE·Filed 2011·Granted Aug 26, 2014·200 cites·24 claims
- 0397US9807882B1Density-optimized module-level inductor ground structureQUALCOMM INC·Filed 2016·Granted Oct 31, 2017·21 cites·20 claims
- 0495US9893048B2Passive-on-glass (POG) device and methodQUALCOMM INC·Filed 2015·Granted Feb 13, 2018·7 cites·30 claims
- 0594US10283257B2Skewed co-spiral inductor structureQUALCOMM INC·Filed 2016·Granted May 7, 2019·12 cites·25 claims
- 0694US10242957B2Compartment shielding in flip-chip (FC) moduleQUALCOMM INC·Filed 2015·Granted Mar 26, 2019·13 cites·30 claims
- 0794US9959964B2Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 1, 2018·6 cites·25 claims
- 0894US8803648B2Three-dimensional multilayer solenoid transformerLO CHI SHUN·Filed 2012·Granted Aug 12, 2014·16 cites·9 claims
- 0993US9620463B2Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)QUALCOMM INC·Filed 2015·Granted Apr 11, 2017·10 cites·29 claims
- 1093US9101068B2Two-stage power delivery architectureQUALCOMM INC·Filed 2013·Granted Aug 4, 2015·14 cites·8 claims
- 1192US10325855B2Backside drill embedded die substrateQUALCOMM INC·Filed 2016·Granted Jun 18, 2019·10 cites·28 claims
- 1292US9001031B2Complex passive design with special via implementationLO CHI SHUN·Filed 2012·Granted Apr 7, 2015·17 cites·34 claims
- 1389US9370103B2Low package parasitic inductance using a thru-substrate interposerQUALCOMM INC·Filed 2013·Granted Jun 14, 2016·9 cites·11 claims
- 1488US9363902B2Three-dimensional multilayer solenoid transformerQUALCOMM MEMS TECHNOLOGIES INC·Filed 2014·Granted Jun 7, 2016·6 cites·7 claims
- 1587US10290414B2Substrate comprising an embedded inductor and a thin film magnetic coreQUALCOMM INC·Filed 2015·Granted May 14, 2019·6 cites·20 claims
- 1687US9425761B2High pass filters and low pass filters using through glass via technologyQUALCOMM INC·Filed 2013·Granted Aug 23, 2016·9 cites·21 claims
- 1787US9203373B2Diplexer design using through glass via technologyQUALCOMM INC·Filed 2013·Granted Dec 1, 2015·8 cites·20 claims
- 1886US10069474B2Encapsulation of acoustic resonator devicesQUALCOMM INC·Filed 2016·Granted Sep 4, 2018·4 cites·30 claims
- 1986US10049815B2Nested through glass via transformerQUALCOMM INC·Filed 2016·Granted Aug 14, 2018·2 cites·21 claims
- 2085US9954267B2Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filterQUALCOMM INC·Filed 2016·Granted Apr 24, 2018·4 cites·25 claims
- 2185US9337799B2Selective tuning of acoustic devicesQUALCOMM MEMS TECHNOLOGIES INC·Filed 2012·Granted May 10, 2016·8 cites·14 claims
- 2284US9875848B2MIM capacitor and method of making the sameQUALCOMM INC·Filed 2015·Granted Jan 23, 2018·4 cites·30 claims
- 2384US9099986B2Cross-sectional dilation mode resonatorsZUO CHENGJIE·Filed 2011·Granted Aug 4, 2015·7 cites·32 claims
- 2483US12094631B2Chip inductor and method for manufacturing sameANHUI ANUKI TECH CO LTD·Filed 2019·Granted Sep 17, 2024·2 cites·9 claims
- 2583US10163771B2Interposer device including at least one transistor and at least one through-substrate viaQUALCOMM INC·Filed 2016·Granted Dec 25, 2018·4 cites·22 claims
- 2683US9813043B2Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methodsQUALCOMM INC·Filed 2016·Granted Nov 7, 2017·3 cites·23 claims
- 2783US9368564B23D pillar inductorQUALCOMM INC·Filed 2014·Granted Jun 14, 2016·5 cites·23 claims
- 2883US9355967B2Stress compensation patterningQUALCOMM INC·Filed 2013·Granted May 31, 2016·5 cites·31 claims
- 2983US9275786B2Superposed structure 3D orthogonal through substrate inductorQUALCOMM INC·Filed 2014·Granted Mar 1, 2016·5 cites·23 claims
- 3082US9966426B2Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 8, 2018·4 cites·20 claims
- 3181US10103135B2Backside ground plane for integrated circuitQUALCOMM INC·Filed 2016·Granted Oct 16, 2018·3 cites·19 claims
- 3280US10312193B2Package comprising switches and filtersQUALCOMM INC·Filed 2016·Granted Jun 4, 2019·4 cites·20 claims
- 3380US9660110B2Varactor device with backside contactQUALCOMM INC·Filed 2014·Granted May 23, 2017·3 cites·30 claims
- 3478US9130505B2Multi-frequency reconfigurable voltage controlled oscillator (VCO) and method of providing sameZUO CHENGJIE·Filed 2011·Granted Sep 8, 2015·4 cites·32 claims
- 3577US10044390B2Glass substrate including passive-on-glass device and semiconductor dieQUALCOMM INC·Filed 2016·Granted Aug 7, 2018·2 cites·17 claims
- 3676US11929725B2Bandpass filter circuit and multiplexerANHUI ANUKI TECH CO LTD·Filed 2020·Granted Mar 12, 2024·1 cites·4 claims
- 3776US9930783B2Passive device assembly for accurate ground plane controlQUALCOMM INC·Filed 2016·Granted Mar 27, 2018·2 cites·37 claims
- 3876US9906318B2Frequency multiplexerQUALCOMM INC·Filed 2015·Granted Feb 27, 2018·3 cites·24 claims
- 3975US9634640B2Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methodsQUALCOMM INC·Filed 2013·Granted Apr 25, 2017·3 cites·19 claims
- 4072US8987976B2Piezoelectric resonator having combined thickness and width vibrational modesZUO CHENGJIE·Filed 2011·Granted Mar 24, 2015·4 cites·18 claims
- 4171US10498307B2Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductorQUALCOMM INC·Filed 2017·Granted Dec 3, 2019·1 cites·24 claims
- 4271US10171112B2RF multiplexer with integrated directional couplersQUALCOMM INC·Filed 2016·Granted Jan 1, 2019·2 cites·16 claims
- 4369US9136574B2Compact 3-D coplanar transmission linesQUALCOMM MEMS TECHNOLOGIES INC·Filed 2013·Granted Sep 15, 2015·2 cites·20 claims
- 4468US10038422B2Single-chip multi-frequency film bulk acoustic-wave resonatorsQUALCOMM INC·Filed 2016·Granted Jul 31, 2018·1 cites·20 claims
- 4567US10553671B23D pillar inductorQUALCOMM INC·Filed 2016·Granted Feb 4, 2020·1 cites·9 claims
- 4667US9780048B1Side-assembled passive devicesQUALCOMM INC·Filed 2016·Granted Oct 3, 2017·1 cites·20 claims
- 4766US9666362B2Superposed structure 3D orthogonal through substrate inductorQUALCOMM INC·Filed 2016·Granted May 30, 2017·1 cites·7 claims
- 4866US9496255B2Stacked CMOS chipset having an insulating layer and a secondary layer and method of forming sameZUO CHENGJIE·Filed 2012·Granted Nov 15, 2016·2 cites·25 claims
- 4965US10249580B2Stacked substrate inductorQUALCOMM INC·Filed 2016·Granted Apr 2, 2019·1 cites·28 claims
- 5065US9876513B2LC filter layer stacking by layer transfer to make 3D multiplexer structuresQUALCOMM INC·Filed 2016·Granted Jan 23, 2018·1 cites·24 claims
Showing the top 50 of 151 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →