Inventor · disambiguated record
Cian Sweeney
Also filed as: SWEENEY CIAN · Sweeney Cian Owen
11 granted patents·2 pending applications·31 citations·filing 2015–2023
87Inventor score
Files withLAM RES CORP13
Top patents by PatentIndex Score
13 records- 0196US9481942B2Geometry and process optimization for ultra-high RPM platingLAM RES CORP·Filed 2015·Granted Nov 1, 2016·9 cites·26 claims
- 0294US11401623B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2021·Granted Aug 2, 2022·3 cites·26 claims
- 0393US11859300B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2022·Granted Jan 2, 2024·2 cites·18 claims
- 0491US9735035B1Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensingLAM RES CORP·Filed 2016·Granted Aug 15, 2017·7 cites·15 claims
- 0587US10927475B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2018·Granted Feb 23, 2021·4 cites·16 claims
- 0681US12392049B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2023·Granted Aug 19, 2025·0 cites·19 claims
- 0779US10593586B2Systems and methods for controlling substrate approach toward a target horizontal planeLAM RES CORP·Filed 2017·Granted Mar 17, 2020·2 cites·20 claims
- 0879US10373858B2Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removalLAM RES CORP·Filed 2016·Granted Aug 6, 2019·3 cites·10 claims
- 0972US2023245917A1Systems and Methods for Controlling Substrate Approach Toward a Target Horizontal PlaneLAM RES CORP·Filed 2023·Application pending·0 cites
- 1071US10497592B2Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensingLAM RES CORP·Filed 2017·Granted Dec 3, 2019·1 cites·18 claims
- 1166US11621187B2Systems and methods for controlling substrate approach toward a target horizontal planeLAM RES CORP·Filed 2020·Granted Apr 4, 2023·0 cites·20 claims
- 1255US10971388B2Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removalLAM RES CORP·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
- 1346US2023260837A1Methods to improve wafer wettability for plating - enhancement through sensors and control algorithmsLAM RES CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →