Inventor · disambiguated record
Cong Lei
Also filed as: LEI CONG
5 granted patents·8 citations·filing 2016–2019
67Inventor score
Files withAVARY HOLDING SHENZHEN CO LTD3FUKUI PREC COMPONENT SHENZHEN1QING DING PREC ELECTRONICS HUAIAN CO LTD1
Top patents by PatentIndex Score
5 records- 0190US10448540B2Ultrathin heat dissipation structureAVARY HOLDING SHENZHEN CO LTD·Filed 2016·Granted Oct 15, 2019·8 cites·10 claims
- 0261US10745595B2Resin composition, adhesive layer, and circuit board utilizing sameQING DING PREC ELECTRONICS (HUAIAN) CO LTD·Filed 2018·Granted Aug 18, 2020·0 cites·11 claims
- 0360US10658265B2Heat dissipation structure, method for making the same, and electronic device having the sameFUKUI PREC COMPONENT SHENZHEN·Filed 2017·Granted May 19, 2020·0 cites·6 claims
- 0455US11380603B2Method for making a heat dissipation structureAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Jul 5, 2022·0 cites·10 claims
- 0555US10923411B2Method for manufacturing an ultrathin heat dissipation structureAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Feb 16, 2021·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →