Inventor · disambiguated record
Conal E. Murray
Also filed as: MURRAY CONAL · MURRAY CONAL E · MURRAY CONAL EUGENE
88 granted patents·12 pending applications·658 citations·filing 2002–2022
99Inventor score
Top patents by PatentIndex Score
100 records- 0198US9748169B1Treating copper interconnectsIBM·Filed 2016·Granted Aug 29, 2017·21 cites·11 claims
- 0298US8492208B1Compressive (PFET) and tensile (NFET) channel strain in nanowire FETs fabricated with a replacement gate processCOHEN GUY·Filed 2012·Granted Jul 23, 2013·35 cites·19 claims
- 0397US9349691B2Semiconductor device with reduced via resistanceIBM·Filed 2014·Granted May 24, 2016·18 cites·10 claims
- 0497US8445892B2p-FET with a strained nanowire channel and embedded SiGe source and drain stressorsCOHEN GUY·Filed 2012·Granted May 21, 2013·31 cites·14 claims
- 0597US8399314B2p-FET with a strained nanowire channel and embedded SiGe source and drain stressorsCOHEN GUY·Filed 2010·Granted Mar 19, 2013·40 cites·20 claims
- 0696US9859157B1Method for forming improved liner layer and semiconductor device including the sameIBM·Filed 2016·Granted Jan 2, 2018·11 cites·17 claims
- 0794US9431354B2Activating reactions in integrated circuits through electrical dischargeIBM·Filed 2014·Granted Aug 30, 2016·12 cites·9 claims
- 0894US8716695B2Compressive (PFET) and tensile (NFET) channel strain in nanowire FETs fabricated with a replacement gate processIBM·Filed 2013·Granted May 6, 2014·16 cites·11 claims
- 0994US7298639B2Reprogrammable electrical fuseIBM·Filed 2005·Granted Nov 20, 2007·25 cites·17 claims
- 1094US7166913B2Heat dissipation for heat generating element of semiconductor device and related methodIBM·Filed 2005·Granted Jan 23, 2007·34 cites·15 claims
- 1193US9748173B1Hybrid interconnects and method of forming the sameIBM·Filed 2016·Granted Aug 29, 2017·8 cites·17 claims
- 1292US9859160B2Semiconductor device with reduced via resistanceIBM·Filed 2016·Granted Jan 2, 2018·5 cites·11 claims
- 1390US9953869B2Semiconductor device with reduced via resistanceIBM·Filed 2016·Granted Apr 24, 2018·4 cites·10 claims
- 1490US7491643B2Method and structure for reducing contact resistance between silicide contact and overlying metallizationIBM·Filed 2006·Granted Feb 17, 2009·16 cites·1 claims
- 1589US8198174B2Air channel interconnects for 3-D integrationHSU LOUIS L·Filed 2009·Granted Jun 12, 2012·19 cites·17 claims
- 1689US7371684B2Process for preparing electronics structures using a sacrificial multilayer hardmask schemeIBM·Filed 2005·Granted May 13, 2008·12 cites·21 claims
- 1788US7923838B2Method and structure for reducing contact resistance between silicide contact and overlying metallizationIBM·Filed 2008·Granted Apr 12, 2011·12 cites·6 claims
- 1888US7067902B2Building metal pillars in a chip for structure supportIBM·Filed 2003·Granted Jun 27, 2006·42 cites·10 claims
- 1988US6974531B2Method for electroplating on resistive substratesIBM·Filed 2002·Granted Dec 13, 2005·20 cites·23 claims
- 2086US7846834B2Interconnect structure and method for Cu/ultra low k integrationIBM·Filed 2008·Granted Dec 7, 2010·12 cites·13 claims
- 2185US9875959B2Forming a stacked capacitorIBM·Filed 2016·Granted Jan 23, 2018·4 cites·11 claims
- 2285US8564025B2Nanowire FET having induced radial strainBANGSARUNTIP SARUNYA·Filed 2012·Granted Oct 22, 2013·6 cites·20 claims
- 2385US7927895B1Varying capacitance voltage contrast structures to determine defect resistanceIBM·Filed 2009·Granted Apr 19, 2011·9 cites·16 claims
- 2484US8138603B2Redundancy design with electro-migration immunityHSU LOUIS L·Filed 2008·Granted Mar 20, 2012·9 cites·25 claims
- 2582US10468296B2Reducing contact resistance in vias for copper interconnectsIBM·Filed 2017·Granted Nov 5, 2019·2 cites·20 claims
- 2682US7419907B2Eliminating metal-rich silicides using an amorphous Ni alloy silicide structureIBM·Filed 2005·Granted Sep 2, 2008·6 cites·12 claims
- 2782US6972209B2Stacked via-stud with improved reliability in copper metallurgyIBM·Filed 2002·Granted Dec 6, 2005·32 cites·8 claims
- 2882US6787912B2Barrier material for copper structuresIBM·Filed 2002·Granted Sep 7, 2004·27 cites·22 claims
- 2981US7282802B2Modified via bottom structure for reliability enhancementIBM·Filed 2004·Granted Oct 16, 2007·24 cites·19 claims
- 3081US2023013937A1Semiconductor device with reduced via resistanceTESSERA LLC·Filed 2022·Application pending·0 cites
- 3180US10361115B2Reducing contact resistance in vias for copper interconnectsIBM·Filed 2016·Granted Jul 23, 2019·2 cites·20 claims
- 3280US7456098B2Building metal pillars in a chip for structure supportIBM·Filed 2006·Granted Nov 25, 2008·8 cites·8 claims
- 3379US8313990B2Nanowire FET having induced radial strainBANGSARUNTIP SARUNYA·Filed 2009·Granted Nov 20, 2012·6 cites·10 claims
- 3479US8309991B2Nanowire FET having induced radial strainBANGSARUNTIP SARUNYA·Filed 2009·Granted Nov 13, 2012·7 cites·22 claims
- 3579US7388224B2Structure for determining thermal cycle reliabilityIBM·Filed 2006·Granted Jun 17, 2008·4 cites·14 claims
- 3678US7947907B2Electronics structures using a sacrificial multi-layer hardmask schemeIBM·Filed 2008·Granted May 24, 2011·5 cites·20 claims
- 3777US11488862B2Semiconductor device with reduced via resistanceTESSERA LLC·Filed 2021·Granted Nov 1, 2022·0 cites·19 claims
- 3877US8624395B2Redundancy design with electro-migration immunity and method of manufactureHSU LOUIS L·Filed 2012·Granted Jan 7, 2014·3 cites·17 claims
- 3976US9735051B2Semiconductor device interconnect structures formed by metal reflow processIBM·Filed 2015·Granted Aug 15, 2017·2 cites·17 claims
- 4075US8212218B2Dosimeter powered by passive RF absorptionCABRAL JR CYRIL·Filed 2009·Granted Jul 3, 2012·7 cites·20 claims
- 4174US9058887B2Reprogrammable electrical fuseHSU LOUIS C·Filed 2007·Granted Jun 16, 2015·6 cites·17 claims
- 4273US9870960B2Capacitance monitoring using X-ray diffractionIBM·Filed 2014·Granted Jan 16, 2018·2 cites·20 claims
- 4373US8450205B2Redundancy design with electro-migration immunity and method of manufactureHSU LOUIS L·Filed 2012·Granted May 28, 2013·2 cites·15 claims
- 4473US7214548B2Apparatus and method for flattening a warped substrateIBM·Filed 2004·Granted May 8, 2007·18 cites·29 claims
- 4573US6812143B2Process of forming copper structuresIBM·Filed 2002·Granted Nov 2, 2004·19 cites·15 claims
- 4672US10242943B2Forming a stacked capacitorIBM·Filed 2017·Granted Mar 26, 2019·1 cites·20 claims
- 4772US7811906B1Carbon-on-insulator substrates by in-place bondingIBM·Filed 2009·Granted Oct 12, 2010·5 cites·24 claims
- 4872US7386817B1Method of determining stopping powers of design structures with respect to a traveling particleIBM·Filed 2007·Granted Jun 10, 2008·5 cites·24 claims
- 4971US9991214B2Activating reactions in integrated circuits through electrical dischargeIBM·Filed 2016·Granted Jun 5, 2018·1 cites·10 claims
- 5071US7786578B2Eliminating metal-rich silicides using an amorphous Ni alloy silicide structureIBM·Filed 2008·Granted Aug 31, 2010·3 cites·7 claims
Showing the top 50 of 100 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →