Inventor · disambiguated record
Craig Bishop
Also filed as: BISHOP CRAIG · BISHOP CRAIG A
37 granted patents·9 pending applications·168 citations·filing 1991–2025
96Inventor score
Top patents by PatentIndex Score
46 records- 0197US9040316B1Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clippingDECA TECHNOLOGIES INC·Filed 2014·Granted May 26, 2015·40 cites·23 claims
- 0296US9177926B2Semiconductor device and method comprising thickened redistribution layersDECA TECHNOLOGIES INC·Filed 2015·Granted Nov 3, 2015·30 cites·20 claims
- 0394US12205881B2Semiconductor assembly comprising a 3D block and method of making the sameDECA TECH USA INC·Filed 2023·Granted Jan 21, 2025·2 cites·30 claims
- 0494US11056453B2Stackable fully molded semiconductor structure with vertical interconnectsDECA TECHNOLOGIES INC·Filed 2020·Granted Jul 6, 2021·5 cites·19 claims
- 0593US11616003B2Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnectsDECA TECH USA INC·Filed 2022·Granted Mar 28, 2023·2 cites·18 claims
- 0692US9576919B2Semiconductor device and method comprising redistribution layersDECA TECHNOLOGIES INC·Filed 2015·Granted Feb 21, 2017·11 cites·17 claims
- 0792US8656333B1Integrated circuit package auto-routingBISHOP CRAIG·Filed 2012·Granted Feb 18, 2014·20 cites·19 claims
- 0890US11444051B2Fully molded semiconductor structure with face mounted passives and method of making the sameDECA TECH USA INC·Filed 2021·Granted Sep 13, 2022·2 cites·20 claims
- 0989US10050004B2Fully molded peripheral package on package deviceDECA TECHNOLOGIES INC·Filed 2016·Granted Aug 14, 2018·8 cites·20 claims
- 1088US11728248B2Fully molded semiconductor structure with through silicon via (TSV) vertical interconnectsDECA TECH USA INC·Filed 2022·Granted Aug 15, 2023·1 cites·20 claims
- 1188US9754835B2Semiconductor device and method comprising redistribution layersDECA TECHNOLOGIES INC·Filed 2016·Granted Sep 5, 2017·3 cites·19 claims
- 1287US11887862B2Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDLDECA TECH USA INC·Filed 2022·Granted Jan 30, 2024·1 cites·20 claims
- 1386US2025357351A1Fully molded bridge interposer and method of making the sameDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 1485US9397069B2Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clippingDECA TECHNOLOGIES INC·Filed 2015·Granted Jul 19, 2016·4 cites·20 claims
- 1583US9978655B2Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clippingDECA TECHNOLOGIES INC·Filed 2016·Granted May 22, 2018·3 cites·20 claims
- 1683US9818659B2Multi-die package comprising unit specific alignment and unit specific routingDECA TECHNOLOGIES INC·Filed 2016·Granted Nov 14, 2017·4 cites·20 claims
- 1779US2025308993A1Unit specific variable or adaptive metal fill and system and method for the sameDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 1877US12438065B2Fully molded semiconductor structure with through silicon via (TSV) vertical interconnectsDECA TECH USA INC·Filed 2023·Granted Oct 7, 2025·0 cites·26 claims
- 1977US10056304B2Automated optical inspection of unit specific patterningDECA TECHNOLOGIES INC·Filed 2017·Granted Aug 21, 2018·3 cites·20 claims
- 2076US12469776B2Semiconductor assembly comprising a 3D block and method of making the sameDECA TECH USA INC·Filed 2025·Granted Nov 11, 2025·0 cites·20 claims
- 2175US12334396B2Unit specific variable or adaptive metal fill and system and method for the sameDECA TECH USA INC·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 2274US12381154B2Fully molded bridge interposer and method of making the sameDECA TECH USA INC·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 2373US2025372395A1EMBEDDED COMPONENT INTERPOSER OR SUBSTRATE COMPRISING DISPLACEMENT COMPENSATION TRACES (DCTs) AND METHOD OF MAKING THE SAMEDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 2472US9613830B2Fully molded peripheral package on package deviceDECA TECHNOLOGIES INC·Filed 2016·Granted Apr 4, 2017·2 cites·20 claims
- 2572US9401313B2Automated optical inspection of unit specific patterningDECA TECHNOLOGIES INC·Filed 2015·Granted Jul 26, 2016·2 cites·20 claims
- 2670US12424450B2Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the sameDECA TECH USA INC·Filed 2024·Granted Sep 23, 2025·0 cites·24 claims
- 2770US11791207B2Unit specific variable or adaptive metal fill and system and method for the sameDECA TECH USA INC·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 2870US11538759B2Fully molded bridge interposer and method of making the sameDECA TECH USA INC·Filed 2022·Granted Dec 27, 2022·0 cites·20 claims
- 2969US12057373B2Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the sameDECA TECH USA INC·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 3068US12170261B2Molded direct contact interconnect structure without capture pads and method for the sameDECA TECH USA INC·Filed 2023·Granted Dec 17, 2024·0 cites·30 claims
- 3168US11973051B2Molded direct contact interconnect structure without capture pads and method for the sameDECA TECH USA INC·Filed 2023·Granted Apr 30, 2024·0 cites·30 claims
- 3267US10157803B2Semiconductor device and method of unit specific progressive alignmentDECA TECHNOLOGIES INC·Filed 2017·Granted Dec 18, 2018·1 cites·16 claims
- 3363US12506102B2Fully molded semiconductor structure with face mounted passives and method of making the sameDECA TECH USA INC·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 3463US12500197B2Encapsulant-defined land grid array (LGA) package and method for making the sameDECA TECH USA INC·Filed 2023·Granted Dec 16, 2025·0 cites·22 claims
- 3562US2024404840A1Molded direct contact interconnect substrate and methods of making sameDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 3662US2024395673A1Stackable fully molded semiconductor structure with through vertical interconnectsDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 3761US12261140B2Stackable fully molded semiconductor structure with vertical interconnectsDECA TECH USA INC·Filed 2021·Granted Mar 25, 2025·0 cites·19 claims
- 3859US2024243089A1Layered molded direct contact and dielectric structure and method for making the sameDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 3958US5249364AFront axle toe-in inspection process and apparatusDANA CORP·Filed 1991·Granted Oct 5, 1993·24 cites·20 claims
- 4056US2017372964A1Semiconductor device and method comprising redistribution layersDECA TECHNOLOGIES INC·Filed 2017·Application pending·0 cites
- 4152US11664321B2Multi-step high aspect ratio vertical interconnect and method of making the sameDECA TECH USA INC·Filed 2022·Granted May 30, 2023·0 cites·19 claims
- 4247US10672624B2Method of making fully molded peripheral package on package deviceDECA TECHNOLOGIES INC·Filed 2018·Granted Jun 2, 2020·0 cites·21 claims
- 4344US2016336241A1Automated optical inspection of unit specific patterningDECA TECHNOLOGIES INC·Filed 2016·Application pending·0 cites
- 4442US10573601B2Semiconductor device and method of unit specific progressive alignmentDECA TECHNOLOGIES INC·Filed 2018·Granted Feb 25, 2020·0 cites·20 claims
- 4537US9520364B2Front side package-level serialization for packages comprising unique identifiersDECA TECHNOLOGIES INC·Filed 2015·Granted Dec 13, 2016·0 cites·24 claims
- 4637US2017221830A1Fully molded peripheral package on package deviceDECA TECHNOLOGIES INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →