Inventor · disambiguated record
Crocifisso Marco Antonio Renna
Also filed as: RENNA CROCIFISSO MARCO ANTONIO
12 granted patents·2 pending applications·44 citations·filing 2003–2024
87Inventor score
Top patents by PatentIndex Score
14 records- 0190US9777317B2Microfluidic PCR deviceST MICROELECTRONICS SRL·Filed 2013·Granted Oct 3, 2017·12 cites·38 claims
- 0278US9190539B2Vertical conductive connections in semiconductor substratesST MICROELECTRONICS SRL·Filed 2015·Granted Nov 17, 2015·3 cites·21 claims
- 0376US7585743B2Manufacturing method for a semiconductor substrate comprising at least a buried cavity and devices formed with this methodST MICROELECTRONICS SRL·Filed 2007·Granted Sep 8, 2009·7 cites·22 claims
- 0475US8970006B2Vertical conductive connections in semiconductor substratesRENNA CROCIFISSO MARCO ANTONIO·Filed 2011·Granted Mar 3, 2015·4 cites·16 claims
- 0568US11756916B2Method for the manufacture of integrated devices including a die fixed to a leadframeST MICROELECTRONICS SRL·Filed 2022·Granted Sep 12, 2023·0 cites·16 claims
- 0667US7193256B2Manufacturing method for a semiconductor substrate comprising at least a buried cavity and devices formed with this methodST MICROELECTRONICS SRL·Filed 2003·Granted Mar 20, 2007·14 cites·22 claims
- 0766US8101448B2Manufacturing method of a gas sensor integrated on a semiconductor substrateRENNA CROCIFISSO MARCO ANTONIO·Filed 2009·Granted Jan 24, 2012·4 cites·19 claims
- 0862US11837558B2Process for manufacturing a strained semiconductor device and corresponding strained semiconductor deviceST MICROELECTRONICS SRL·Filed 2021·Granted Dec 5, 2023·0 cites·19 claims
- 0958US11482503B2Method for the manufacture of integrated devices including a die fixed to a leadframeST MICROELECTRONICS SRL·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 1050US2012023841A1Multi-functional solar energy conversion rooftop tiling systemRENNA CROCIFISSO MARCO ANTONIO·Filed 2011·Application pending·0 cites
- 1150US2025125232A1Wettable metalization multilayer with increased adhesion energy, integrated electronic device having a wettable metalization multilayer and manufacturing processST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1249US11075172B2Process for manufacturing a strained semiconductor device and corresponding strained semiconductor deviceST MICROELECTRONICS SRL·Filed 2019·Granted Jul 27, 2021·0 cites·21 claims
- 1343US11894432B2Back side contact structure for a semiconductor device and corresponding manufacturing processST MICROELECTRONICS SRL·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 1434US9018730B2Microstructure device comprising a face to face electromagnetic near field coupling between stacked device portions and method of forming the deviceRENNA CROCIFISSO MARCO ANTONIO·Filed 2012·Granted Apr 28, 2015·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →