Inventor · disambiguated record
Daniel M. Andrews
Also filed as: ANDREWS DANIEL M · ANDREWS DANIEL MICHAEL
8 granted patents·1 pending application·299 citations·filing 1979–2007
90Inventor score
Top patents by PatentIndex Score
9 records- 0188US4776509ASingle point bonding method and apparatusMICROELECTRONICS & COMPUTER·Filed 1987·Granted Oct 11, 1988·94 cites·7 claims
- 0280US4934582AMethod and apparatus for removing solder mounted electronic componentsMICROELECTRONICS & COMPUTER·Filed 1989·Granted Jun 19, 1990·41 cites·22 claims
- 0376US4845335ALaser Bonding apparatus and methodMICROELECTRONICS & COMPUTER·Filed 1988·Granted Jul 4, 1989·45 cites·9 claims
- 0474US5072874AMethod and apparatus for using desoldering materialMICROELECTRONICS & COMPUTER·Filed 1991·Granted Dec 17, 1991·56 cites·40 claims
- 0561US4852250AHermetically sealed package having an electronic component and method of makingMICROELECTRONICS & COMPUTER·Filed 1988·Granted Aug 1, 1989·27 cites·6 claims
- 0657US2008110579A1Adjustable window corniceANDREWS DANIEL MICHAEL·Filed 2007·Application pending·0 cites
- 0752US4991286AMethod for replacing defective electronic componentsMICROELECTRONICS & COMPUTER·Filed 1989·Granted Feb 12, 1991·14 cites·7 claims
- 0844US4278991AIC Package with heat sink and minimal cross-sectional areaBURROUGHS CORP·Filed 1979·Granted Jul 14, 1981·13 cites·7 claims
- 0934US5029747AApparatus for replacing defective electronic componentsMICROELECTRONICS & COMPUTER·Filed 1990·Granted Jul 9, 1991·9 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →