Inventor · disambiguated record
David V. Caletka
Also filed as: CALETKA DAVID V
4 granted patents·1 pending application·27 citations·filing 2005–2008
74Inventor score
Files withENDICOTT INTERCONNECT TECH INC5
Top patents by PatentIndex Score
5 records- 0189US7510912B2Method of making wirebond electronic package with enhanced chip pad designENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 31, 2009·17 cites·6 claims
- 0274US7875811B2High speed interposerENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Jan 25, 2011·4 cites·5 claims
- 0373US7629541B2High speed interposerENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Dec 8, 2009·4 cites·7 claims
- 0463US7253518B2Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Aug 7, 2007·2 cites·13 claims
- 0555US2008120835A1Method of making high speed interposerENDICOTT INTERCONNECT TECH INC·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →