Inventor · disambiguated record
Daniel Chesire
Also filed as: CHESIRE DANIEL · CHESIRE DANIEL P · CHESIRE DANIEL PATRICK
17 granted patents·2 pending applications·349 citations·filing 1992–2015
95Inventor score
Files withAGERE SYSTEMS INC12AGERE SYSTEMS LLC1ARCHER III VANCE D1AT & T BELL LAB1LUCENT TECHNOLOGIES INC1
Top patents by PatentIndex Score
19 records- 0192US7301231B2Reinforced bond pad for a semiconductor deviceAGERE SYSTEMS INC·Filed 2006·Granted Nov 27, 2007·31 cites·7 claims
- 0291US7429502B2Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sinkAGERE SYSTEMS INC·Filed 2007·Granted Sep 30, 2008·23 cites·10 claims
- 0390US7115985B2Reinforced bond pad for a semiconductor deviceAGERE SYSTEMS INC·Filed 2004·Granted Oct 3, 2006·65 cites·10 claims
- 0484US9331667B2Methods, systems, and apparatuses for temperature compensated surface acoustic wave deviceTRIQUINT SEMICONDUCTOR INC·Filed 2014·Granted May 3, 2016·8 cites·19 claims
- 0582US8319343B2Routing under bond pad for the replacement of an interconnect layerARCHER III VANCE D·Filed 2006·Granted Nov 27, 2012·13 cites·10 claims
- 0681US7397103B2Semiconductor with damage detection circuitryAGERE SYSTEMS INC·Filed 2005·Granted Jul 8, 2008·11 cites·13 claims
- 0779US7777333B2Structure and method for fabricating flip chip devicesAGERE SYSTEMS INC·Filed 2006·Granted Aug 17, 2010·9 cites·17 claims
- 0878US5264377AIntegrated circuit electromigration monitorAT & T BELL LAB·Filed 1992·Granted Nov 23, 1993·67 cites·28 claims
- 0977US6153543AHigh density plasma passivation layer and method of applicationLUCENT TECHNOLOGIES INC·Filed 1999·Granted Nov 28, 2000·60 cites·9 claims
- 1076US7328830B2Structure and method for bonding to copper interconnect structuresAGERE SYSTEMS INC·Filed 2003·Granted Feb 12, 2008·22 cites·16 claims
- 1175US7476951B2Selective isotropic etch for titanium-based materialsAGERE SYSTEMS INC·Filed 2006·Granted Jan 13, 2009·6 cites·15 claims
- 1267US6960836B2Reinforced bond padAGERE SYSTEMS INC·Filed 2003·Granted Nov 1, 2005·13 cites·6 claims
- 1366US7327029B2Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sinkAGERE SYSTEMS INC·Filed 2005·Granted Feb 5, 2008·3 cites·10 claims
- 1465US7078337B2Selective isotropic etch for titanium-based materialsAGERE SYSTEMS INC·Filed 2003·Granted Jul 18, 2006·11 cites·32 claims
- 1560US9973169B2Surface acoustic wave filter with a cap layer for improved reliabilityRF MICRO DEVICES INC·Filed 2015·Granted May 15, 2018·1 cites·18 claims
- 1655US7221173B2Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping processAGERE SYSTEMS INC·Filed 2004·Granted May 22, 2007·6 cites·10 claims
- 1753US7973544B2Thermal monitoring and management of integrated circuitsAGERE SYSTEMS INC·Filed 2008·Granted Jul 5, 2011·0 cites·20 claims
- 1848US2013056868A1Routing under bond pad for the replacement of an interconnect layerAGERE SYSTEMS LLC·Filed 2012·Application pending·0 cites
- 1931US2003218259A1Bond pad support structure for a semiconductor deviceFiled 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Daniel Chesire files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →