Inventor · disambiguated record
David Chin
Also filed as: CHIN DAVID · CHIN DAVID T · CHIN DAVID TAIWAI
7 granted patents·1 pending application·23 citations·filing 2008–2020
78Inventor score
Top patents by PatentIndex Score
8 records- 0189US7836586B2Thin foil semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2008·Granted Nov 23, 2010·15 cites·11 claims
- 0275US8101470B2Foil based semiconductor packagePODDAR ANINDYA·Filed 2009·Granted Jan 24, 2012·7 cites·19 claims
- 0358US8375577B2Method of making foil based semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2008·Granted Feb 19, 2013·1 cites·11 claims
- 0453US8857047B2Thin foil semiconductor packageTEXAS INSTRUMENTS INC·Filed 2012·Granted Oct 14, 2014·0 cites·6 claims
- 0549US8341828B2Thin foil semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2010·Granted Jan 1, 2013·0 cites·5 claims
- 0647US11855001B2Leadless leadframe and semiconductor device package therefromTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 26, 2023·0 cites·38 claims
- 0727US2012057313A1Package for system level electronic productsDARBINYAN ARTUR·Filed 2010·Application pending·0 cites
- 0824US8650748B2Universal chip carrier and methodDARBINYAN ARTUR·Filed 2011·Granted Feb 18, 2014·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →