Inventor · disambiguated record
Dae-Sang Chun
Also filed as: CHUN DAE-SANG
2 granted patents·1 pending application·2 citations·filing 2005–2019
35Inventor score
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0162US7452753B2Method of processing a semiconductor wafer for manufacture of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 18, 2008·2 cites·10 claims
- 0241US10741448B2Method of singulating semiconductor die and method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 11, 2020·0 cites·20 claims
- 0338US2007023487A1Wire bonding method and device of performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →