Inventor · disambiguated record
David B. Clegg
Also filed as: CLEGG DAVID · CLEGG DAVID B
4 granted patents·2 pending applications·158 citations·filing 1997–2014
76Inventor score
Top patents by PatentIndex Score
6 records- 0195US6713381B2Method of forming semiconductor device including interconnect barrier layersMOTOROLA INC·Filed 2002·Granted Mar 30, 2004·135 cites·13 claims
- 0275US9111755B1Bond pad and passivation layer having a gap and method for formingTRAN TU-ANH N·Filed 2014·Granted Aug 18, 2015·4 cites·20 claims
- 0355US6117759AMethod for multiplexed joining of solder bumps to various substrates during assembly of an integrated circuit packageMOTOROLA INC·Filed 1997·Granted Sep 12, 2000·19 cites·41 claims
- 0438US9515034B2Bond pad having a trench and method for formingSAFAI SOHRAB·Filed 2014·Granted Dec 6, 2016·0 cites·20 claims
- 0535US2015194395A1Bond pad having a trench and method for formingSAFAI SOHRAB·Filed 2014·Application pending·0 cites
- 0627US2002000665A1Semiconductor device conductive bump and interconnect barrierFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →