Inventor · disambiguated record
David Conklin
Also filed as: CONKLIN DAVID · CONKLIN DAVID C
10 granted patents·20 pending applications·5 citations·filing 2003–2024
79Inventor score
Top patents by PatentIndex Score
30 records- 0187US12381093B2Hybrid patterning-bonding semiconductor toolTOKYO ELECTRON LTD·Filed 2022·Granted Aug 5, 2025·1 cites·18 claims
- 0280US12204253B2In-situ lithography pattern enhancement with localized stress treatment tuning using heat zonesTOKYO ELECTRON LTD·Filed 2024·Granted Jan 21, 2025·0 cites·9 claims
- 0375US11526088B2Coaxial see-through alignment imaging systemTOKYO ELECTRON LTD·Filed 2021·Granted Dec 13, 2022·0 cites·9 claims
- 0472US11994807B2In-situ lithography pattern enhancement with localized stress treatment tuning using heat zonesTOKYO ELECTRON LTD·Filed 2023·Granted May 28, 2024·0 cites·13 claims
- 0570US12374562B2Wafer shape control for W2W bondingTOKYO ELECTRON LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 0664US2025298316A1Autocatalytic acid amplification for photoselective acid diffusionTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0764US2024419074A1Formation of sub-lithographic mandrel patterns using reversible overcoatTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0864US2025298319A1Photoresist patterning using planar trim layerTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0963US12505998B2Method for chuck compensation via wafer shape controlTOKYO ELECTRON LTD·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 1063US2025189901A1Critical dimension uniformity tuning based on mask design feature densityTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1160US12512356B2Apparatus and method for wafer alignmentTOKYO ELECTRON LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 1260US2025029837A1Methods and compositions for trench formation using advanced track-based patterning processesTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1359US12411412B2Patterning semiconductor featuresTOKYO ELECTRON LTD·Filed 2022·Granted Sep 9, 2025·0 cites·21 claims
- 1459US2025308951A1Die to wafer bonding method and apparatus with thermal contactless die shape controlTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1559US2025308902A1Using laser based system for mean of shaping of unsingulated & singulated dies by substrate lattice manipulationTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1658US2025306468A1Multipatterning with crosslinkable overcoatTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1758US2025259943A1Die shape control for die to wafer bond enhancementTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1858US2023350303A1Dry Developing Metal-Free PhotoresistsTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1958US2025172877A1Reversible overcoat compositionsTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 2057US2025300010A1Method for patterning for chemical mechanical polishing (cmp) iso-dense bias compensation using z-heightTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 2157US2025306463A1Patterning a substrate using a multi-patterning techniqueTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 2257US2025308949A1Die to wafer bonding method and apparatus with thermal contact die shape controlTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 2357US2025226265A1Correcting of design and mask shape position due to die and wafer distortion for bondingTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 2456US2025191970A1Fully self-aligned vias using a hardmask and antispacersTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2554US12381118B23D multiple location compressing bonded arm for advanced integrationTOKYO ELECTRON LTD·Filed 2022·Granted Aug 5, 2025·0 cites·12 claims
- 2654US2024363340A1Inorganic/hybrid stress filmsTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2753US2023251570A1Selective Deprotection via Dye DiffusionTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2852US2023290676A1Self Aligned Multiple Patterning MethodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2949US2022336226A1Method of correcting wafer bow using a direct write stress filmTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 3046US7077311B1Document transport control systemBANCTEC INC·Filed 2003·Granted Jul 18, 2006·4 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →