Inventor · disambiguated record
David Danovitch
Also filed as: DANOVITCH DAVID · DANOVITCH DAVID H · DANOVITCH DAVID HIRSCH
22 granted patents·6 pending applications·770 citations·filing 1991–2021
96Inventor score
Top patents by PatentIndex Score
28 records- 0193US7348270B1Techniques for forming interconnectsIBM·Filed 2007·Granted Mar 25, 2008·23 cites·22 claims
- 0293US5202943AOptoelectronic assembly with alignment memberIBM·Filed 1991·Granted Apr 13, 1993·152 cites·23 claims
- 0392US5775569AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1996·Granted Jul 7, 1998·120 cites·16 claims
- 0489US6276596B1Low temperature solder column attach by injection molded solder and structure formedIBM·Filed 2000·Granted Aug 21, 2001·54 cites·20 claims
- 0585US6149122AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1998·Granted Nov 21, 2000·61 cites·5 claims
- 0685US6003757AApparatus for transferring solder bumps and method of usingIBM·Filed 1998·Granted Dec 21, 1999·81 cites·41 claims
- 0784US6340630B1Method for making interconnect for low temperature chip attachmentIBM·Filed 2000·Granted Jan 22, 2002·28 cites·18 claims
- 0883US6390439B1Hybrid molds for molten solder screening processIBM·Filed 1999·Granted May 21, 2002·44 cites·40 claims
- 0982US10559549B2Gallium liquid metal embrittlement for device reworkIBM·Filed 2017·Granted Feb 11, 2020·2 cites·3 claims
- 1082US8689437B2Method for forming integrated circuit assemblyDANG BING·Filed 2009·Granted Apr 8, 2014·11 cites·20 claims
- 1180US6127735AInterconnect for low temperature chip attachmentIBM·Filed 1996·Granted Oct 3, 2000·41 cites·15 claims
- 1278US6832747B2Hybrid molds for molten solder screening processIBM·Filed 2002·Granted Dec 21, 2004·18 cites·17 claims
- 1378US6133633AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1998·Granted Oct 17, 2000·40 cites·4 claims
- 1476US6566612B2Method for direct chip attach by solder bumps and an underfill layerIBM·Filed 2002·Granted May 20, 2003·20 cites·8 claims
- 1573US5897336ADirect chip attach for low alpha emission interconnect systemIBM·Filed 1997·Granted Apr 27, 1999·42 cites·43 claims
- 1661US2011079632A1Multistack solder wafer fillingIBM·Filed 2009·Application pending·0 cites
- 1759US6341418B1Method for direct chip attach by solder bumps and an underfill layerIBM·Filed 1999·Granted Jan 29, 2002·21 cites·23 claims
- 1857US8162199B2Mold shave apparatus and injection molded soldering processBOURCHARD ERIC E·Filed 2009·Granted Apr 24, 2012·1 cites·4 claims
- 1954US2008156849A1Mold shave apparatus and injection molded soldering processIBM·Filed 2007·Application pending·0 cites
- 2053US2012234902A1Multistack solder wafer fillingCHEY S JAY·Filed 2012·Application pending·0 cites
- 2152US7819376B2Techniques for forming interconnectsIBM·Filed 2007·Granted Oct 26, 2010·0 cites·25 claims
- 2252US7070087B2Method and apparatus for transferring solder bumpsIBM·Filed 2003·Granted Jul 4, 2006·6 cites·16 claims
- 2350US10679966B2Gallium liquid metal embrittlement for device reworkIBM·Filed 2017·Granted Jun 9, 2020·0 cites·13 claims
- 2447US2024113060A1Heterogeneous solder bump structureSOC DE COMMERCIALISATION DES PRODUITS DE LA RECHERCHE APPLIQUEE SOCPRA SCIENCES ET GENIE S E C·Filed 2021·Application pending·0 cites
- 2546US2006289607A1Composite solder transfer moldplate structure and method of making sameBUCHWALTER STEPHEN L·Filed 2005·Application pending·0 cites
- 2638US2002023945A1Low temperature solder column attach by injection molded solder and structure formedIBM·Filed 2001·Application pending·0 cites
- 2730US7038462B2Method and apparatus for electrical commoning of circuitsIBM·Filed 2004·Granted May 2, 2006·0 cites·20 claims
- 2830US6112976AMethod of manufacturing wire segments of homogeneous compositionIBM·Filed 1998·Granted Sep 5, 2000·5 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →