Inventor · disambiguated record
David Daycock
Also filed as: DAYCOCK DAVID · DAYCOCK DAVID A
62 granted patents·24 pending applications·100 citations·filing 2006–2025
98Inventor score
Top patents by PatentIndex Score
86 records- 0197US10283520B2Elevationally-extending string of memory cells individually comprising a programmable charge storage transistor and method of forming an elevationally-extending string of memory cells individually comprising a programmable charge storage transistorMICRON TECHNOLOGY INC·Filed 2016·Granted May 7, 2019·20 cites·31 claims
- 0297US10083981B2Memory arrays, and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 25, 2018·22 cites·17 claims
- 0396US10256249B2Integrated structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 9, 2019·10 cites·7 claims
- 0496US10229923B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 12, 2019·10 cites·20 claims
- 0596US10038008B1Integrated structures and NAND memory arraysMICRON TECHNOLOGY INC·Filed 2017·Granted Jul 31, 2018·13 cites·21 claims
- 0691US12363895B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2024·Granted Jul 15, 2025·0 cites·14 claims
- 0790US11158577B2Methods for fabricating microelectronic devices with contacts to conductive staircase steps, and related devices and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Oct 26, 2021·4 cites·18 claims
- 0890US2025098169A1Integrated StructuresMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0989US10734395B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 4, 2020·2 cites·11 claims
- 1086US12029032B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2023·Granted Jul 2, 2024·0 cites·17 claims
- 1185US2025301648A1Microelectronic devices including pillars with upper portions having perimeters interrputed by elongate isolation structuresLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 1284US12266630B2Bond pad connection layoutLODESTAR LICENSING GROUP LLC·Filed 2024·Granted Apr 1, 2025·0 cites·20 claims
- 1384US10318170B2Solid state memory componentINTEL CORP·Filed 2018·Granted Jun 11, 2019·3 cites·25 claims
- 1483US12324154B2Microelectronic devices including pillars with partially-circular upper portions and circular lower portions, and related methodsLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Jun 3, 2025·0 cites·19 claims
- 1582US12363916B2Memory devices including strings of memory cells and related systemsMICRON TECHNOLOGY INC·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 1682US11177159B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 16, 2021·4 cites·27 claims
- 1782US9857989B1Solid state memory componentINTEL CORP·Filed 2016·Granted Jan 2, 2018·3 cites·16 claims
- 1881US2025338508A1Electronic devices including fill materials and conductive structuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1979US12250820B2Elevationally-extending string of memory cells and methods of forming an elevationally-extending string of memory cellsMICRON TECHNOLOGY INC·Filed 2023·Granted Mar 11, 2025·0 cites·12 claims
- 2079US2025142820A1Integrated Assemblies and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2179US2025142827A1Integrated StructuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2279US2025210581A1Bond pad connection layoutLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 2379US2025185248A1Elevationally-Extending String of Memory Cells and Methods of Forming an Elevationally-Extending String of Memory CellsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2478US11876068B2Bond pad connection layoutMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 16, 2024·0 cites·20 claims
- 2578US11631684B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 18, 2023·0 cites·9 claims
- 2678US11152388B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 19, 2021·2 cites·6 claims
- 2777US12185537B2Integrated structuresMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 31, 2024·0 cites·31 claims
- 2877US11800717B2Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 2977US9153455B2Methods of forming semiconductor device structures, memory cells, and arraysMICRON TECHNOLOGY INC·Filed 2013·Granted Oct 6, 2015·2 cites·21 claims
- 3077US2025159944A1Methods of forming semiconductor devices having linersMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3175US10998326B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted May 4, 2021·0 cites·8 claims
- 3275US2022278214A1Semiconductor devices with liners and related methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3374US9741732B2Integrated structuresMICRON TECHNOLOGY INC·Filed 2015·Granted Aug 22, 2017·1 cites·26 claims
- 3473US10658380B2Formation of termination structures in stacked memory arraysMICRON TECHNOLOGY INC·Filed 2018·Granted May 19, 2020·1 cites·24 claims
- 3572US11616075B2Elevationally-extending string of memory cells and methods of forming an elevationally-extending string of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted Mar 28, 2023·0 cites·39 claims
- 3672US11322516B2Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted May 3, 2022·0 cites·25 claims
- 3772US10304853B2Memory arrays, and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2018·Granted May 28, 2019·1 cites·13 claims
- 3872US2024274538A1Microelectronic devices with conductive extensions between upper staircase steps and their contacts, and related methodsLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 3971US11744086B2Methods of forming electronic devices, and related electronic devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 29, 2023·0 cites·25 claims
- 4071US11502053B2Bond pad connection layoutMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 15, 2022·0 cites·22 claims
- 4171US9985040B2Integrated circuitry and 3D memoryMICRON TECHNOLOGY INC·Filed 2016·Granted May 29, 2018·2 cites·20 claims
- 4269US11081495B2Integrated structuresMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 3, 2021·0 cites·20 claims
- 4369US10483270B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 19, 2019·0 cites·8 claims
- 4467US2025078911A1Methods of forming microelectronic devices, and related microelectronic devices and memory devicesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 4567US2025048614A1Microelectronic devices and memory devices including vertically spaced transistors and storage devices, and related electronic systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 4667US2025194090A1Integrated Circuitry, Memory Circuitry, And Method Of Forming Integrated CircuitryMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 4766US11177279B2Formation of termination structures in stacked memory arraysMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 16, 2021·0 cites·20 claims
- 4866US10355018B1Integrated structuresMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 16, 2019·0 cites·15 claims
- 4966US2025365919A1Substrate isolation in a three dimensional (3d) memory arrayMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 5065US12010836B2Memory arrays and methods used in forming a memory array comprising strings of memory cells and operative through-array-viasMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 11, 2024·0 cites·18 claims
Showing the top 50 of 86 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when David Daycock files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →