Inventor · disambiguated record
Darrell W. Foote
Also filed as: FOOTE DARRELL · FOOTE DARRELL W
2 granted patents·21 citations·filing 2014–2017
53Inventor score
Technology areasH10P
Files withLINDSEY JR PAUL C2
Top patents by PatentIndex Score
2 records- 0189US8906745B1Method using fluid pressure to remove back metal from semiconductor wafer scribe streetsLINDSEY JR PAUL C·Filed 2014·Granted Dec 9, 2014·21 cites·20 claims
- 0242US10056297B1Modified plasma dicing process to improve back metal cleavingLINDSEY JR PAUL C·Filed 2017·Granted Aug 21, 2018·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →