Inventor · disambiguated record
Daniel Fulford
Also filed as: FULFORD DANIEL · FULFORD DANIEL J
27 granted patents·9 pending applications·29 citations·filing 2014–2024
92Inventor score
Files withTOKYO ELECTRON LTD36
Top patents by PatentIndex Score
36 records- 0194US10453692B2Location-specific tuning of stress to control bow to control overlay in semiconductor processingTOKYO ELECTRON LTD·Filed 2017·Granted Oct 22, 2019·9 cites·20 claims
- 0294US10431468B2Location-specific tuning of stress to control bow to control overlay in semiconductor processingTOKYO ELECTRON LTD·Filed 2017·Granted Oct 1, 2019·8 cites·19 claims
- 0384US9977339B2System and method for shifting critical dimensions of patterned filmsTOKYO ELECTRON LTD·Filed 2015·Granted May 22, 2018·3 cites·20 claims
- 0483US12276922B2Backside deposition tuning of stress to control wafer bow in semiconductor processingTOKYO ELECTRON LTD·Filed 2021·Granted Apr 15, 2025·1 cites·20 claims
- 0582US9646898B2Methods for treating a substrate by optical projection of a correction pattern based on a detected spatial heat signature of the substrateTOKYO ELECTRON LTD·Filed 2014·Granted May 9, 2017·4 cites·10 claims
- 0681US10923363B1Method for increasing pattern density on a waferTOKYO ELECTRON LTD·Filed 2019·Granted Feb 16, 2021·3 cites·20 claims
- 0780US12204253B2In-situ lithography pattern enhancement with localized stress treatment tuning using heat zonesTOKYO ELECTRON LTD·Filed 2024·Granted Jan 21, 2025·0 cites·9 claims
- 0874US12341053B2System for backside deposition of a substrateTOKYO ELECTRON LTD·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 0972US11994807B2In-situ lithography pattern enhancement with localized stress treatment tuning using heat zonesTOKYO ELECTRON LTD·Filed 2023·Granted May 28, 2024·0 cites·13 claims
- 1067US9735067B2Substrate tuning system and method using optical projectionTOKYO ELECTRON LTD·Filed 2014·Granted Aug 15, 2017·1 cites·9 claims
- 1166US2025297969A1Reflecting non-planar surfaces integrated with laser scan for poseidon tool integrationTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1263US12505998B2Method for chuck compensation via wafer shape controlTOKYO ELECTRON LTD·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 1363US12435964B2Contactless capacitive measurement tool with improved throughput and accuracyTOKYO ELECTRON LTD·Filed 2023·Granted Oct 7, 2025·0 cites·23 claims
- 1463US2025189901A1Critical dimension uniformity tuning based on mask design feature densityTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1562US11854806B2Method for pattern reduction using a staircase spacerTOKYO ELECTRON LTD·Filed 2021·Granted Dec 26, 2023·0 cites·14 claims
- 1662US11776812B2Method for pattern reduction using a staircase spacerTOKYO ELECTRON LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 1760US12001147B2Precision multi-axis photolithography alignment correction using stressor filmTOKYO ELECTRON LTD·Filed 2022·Granted Jun 4, 2024·0 cites·7 claims
- 1860US2025290745A1Apparatus and method for determining the surface profile of a semiconductor substrate using a laser scanning techniqueTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1959US12455511B2In-situ lithography pattern enhancement with localized stress treatment tuning using heat zonesTOKYO ELECTRON LTD·Filed 2022·Granted Oct 28, 2025·0 cites·11 claims
- 2059US2025123090A1Device and method for determining wafer bowTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2159US2025167024A1Wafer support for measuring wafer geometryTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2257US11721551B2Localized stress regions for three-dimension chiplet formationTOKYO ELECTRON LTD·Filed 2021·Granted Aug 8, 2023·0 cites·16 claims
- 2355US11688642B2Localized stress regions for three-dimension chiplet formationTOKYO ELECTRON LTD·Filed 2021·Granted Jun 27, 2023·0 cites·8 claims
- 2454US12381118B23D multiple location compressing bonded arm for advanced integrationTOKYO ELECTRON LTD·Filed 2022·Granted Aug 5, 2025·0 cites·12 claims
- 2554US11908728B2System for backside deposition of a substrateTOKYO ELECTRON LTD·Filed 2018·Granted Feb 20, 2024·0 cites·20 claims
- 2654US2023251574A1Method to enhance lithography pattern creation using semiconductor stress film tuningTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2752US11393694B2Method for planarization of organic filmsTOKYO ELECTRON LTD·Filed 2019·Granted Jul 19, 2022·0 cites·20 claims
- 2852US2021294148A1Planarizing Organic FilmsTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 2951US11841617B2Method of forming a narrow trenchTOKYO ELECTRON LTD·Filed 2020·Granted Dec 12, 2023·0 cites·20 claims
- 3050US11883837B2System and method for liquid dispense and coverage controlTOKYO ELECTRON LTD·Filed 2021·Granted Jan 30, 2024·0 cites·9 claims
- 3150US11201051B2Method for layer by layer growth of conformal filmsTOKYO ELECTRON LTD·Filed 2019·Granted Dec 14, 2021·0 cites·20 claims
- 3249US11335566B2Method for planarization of spin-on and CVD-deposited organic filmsTOKYO ELECTRON LTD·Filed 2020·Granted May 17, 2022·0 cites·20 claims
- 3349US2023052800A1Methods of Forming PatternsTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 3448US11990334B2Method for tuning stress transitions of films on a substrateTOKYO ELECTRON LTD·Filed 2020·Granted May 21, 2024·0 cites·15 claims
- 3548US11656550B2Controlling semiconductor film thicknessTOKYO ELECTRON LTD·Filed 2020·Granted May 23, 2023·0 cites·21 claims
- 3642US2019287793A1System and Method for Tuning Thickness of Resist FilmsTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Daniel Fulford files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →