Inventor · disambiguated record
David Maxwell Gage
Also filed as: GAGE DAVID · GAGE DAVID M · GAGE DAVID MAXWELL
13 granted patents·11 pending applications·9 citations·filing 2011–2024
86Inventor score
Top patents by PatentIndex Score
24 records- 0187US11865664B2Profile control with multiple instances of contol algorithm during polishingAPPLIED MATERIALS INC·Filed 2021·Granted Jan 9, 2024·1 cites·19 claims
- 0287US11658078B2Using a trained neural network for use in in-situ monitoring during polishing and polishing systemAPPLIED MATERIALS INC·Filed 2021·Granted May 23, 2023·1 cites·17 claims
- 0386US11850699B2Switching control algorithms on detection of exposure of underlying layer during polishingAPPLIED MATERIALS INC·Filed 2021·Granted Dec 26, 2023·1 cites·18 claims
- 0483US12136574B2Technique for training neural network for use in in-situ monitoring during polishing and polishing systemAPPLIED MATERIALS INC·Filed 2023·Granted Nov 5, 2024·0 cites·17 claims
- 0581US12057354B2Trained neural network in in-situ monitoring during polishing and polishing systemAPPLIED MATERIALS INC·Filed 2023·Granted Aug 6, 2024·0 cites·21 claims
- 0680US11780045B2Compensation for substrate doping for in-situ electromagnetic inductive monitoringAPPLIED MATERIALS INC·Filed 2019·Granted Oct 10, 2023·1 cites·19 claims
- 0780US2024116152A1Switching control algorithms on detection of exposure of underlying layer during polishingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0878US11075165B2Methods and apparatus for forming dual metal interconnectsAPPLIED MATERIALS INC·Filed 2019·Granted Jul 27, 2021·2 cites·18 claims
- 0977US10350723B2Overpolishing based on electromagnetic inductive monitoring of trench depthAPPLIED MATERIALS INC·Filed 2017·Granted Jul 16, 2019·1 cites·20 claims
- 1074US11791224B2Technique for training neural network for use in in-situ monitoring during polishing and polishing systemAPPLIED MATERIALS INC·Filed 2021·Granted Oct 17, 2023·0 cites·16 claims
- 1165US11787008B2Chemical mechanical polishing with applied magnetic fieldAPPLIED MATERIALS INC·Filed 2020·Granted Oct 17, 2023·0 cites·18 claims
- 1264US11948885B2Methods and apparatus for forming dual metal interconnectsAPPLIED MATERIALS INC·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 1362US9073169B2Feedback control of polishing using optical detection of clearanceXU KUN·Filed 2011·Granted Jul 7, 2015·2 cites·26 claims
- 1459US2025256371A1Endpoint control for inconsistent underlayerAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1559US2025256372A1Multi-zone profile control for inconsistent underlayerAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1659US2025256373A1Generation of Starting Thickness Profile Using In-SITU Monitoring SystemAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1756US2025262712A1Processing of scaled signals from in-situ monitoring system in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1856US2025262711A1Processing of signals from in-situ monitoring system in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1954US12447578B2Compensation for substrate doping in edge reconstruction for in-situ electromagnetic inductive monitoringAPPLIED MATERIALS INC·Filed 2018·Granted Oct 21, 2025·0 cites·24 claims
- 2053US2024282709A1Layered Substrate with Ruthenium Layer and Method for ProducingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2142US2014199842A1Chemical mechanical polishing process and slurry containing silicon nanoparticlesAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 2241US2014308814A1Chemical mechanical polishing methods and systems including pre-treatment phase and pre-treatment compositionsAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 2336US2012276662A1Eddy current monitoring of metal featuresIRAVANI HASSAN G·Filed 2011·Application pending·0 cites
- 2436US2012276817A1Eddy current monitoring of metal residue or metal pillarsIRAVANI HASSAN G·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →