Inventor · disambiguated record
David Gani
Also filed as: GANI DAVID
34 granted patents·9 pending applications·74 citations·filing 1998–2025
95Inventor score
Files withST MICROELECTRONICS PTE LTD30ST MICROELECTRONICS LTD3ST MICROELECTRONICS INT NV2WONG WINGSHENQ2AKZO NOBEL NV1
Top patents by PatentIndex Score
43 records- 0193US9793427B1Air venting on proximity sensorST MICROELECTRONICS PTE LTD·Filed 2016·Granted Oct 17, 2017·11 cites·20 claims
- 0292US10147834B2Overmold proximity sensor and associated methodsST MICROELECTRONICS PTE LTD·Filed 2015·Granted Dec 4, 2018·11 cites·23 claims
- 0388US11069667B2Wafer level proximity sensorST MICROELECTRONICS PTE LTD·Filed 2016·Granted Jul 20, 2021·6 cites·19 claims
- 0486US11404355B2Package with lead frame with improved lead design for discrete electrical components and manufacturing the sameST MICROELECTRONICS PTE LTD·Filed 2020·Granted Aug 2, 2022·2 cites·20 claims
- 0584US8576574B2Electromagnetic interference shielding on semiconductor devicesWONG WINGSHENQ·Filed 2010·Granted Nov 5, 2013·13 cites·9 claims
- 0682US12356743B2Slanted glass edge for image sensor packageST MICROELECTRONICS PTE LTD·Filed 2024·Granted Jul 8, 2025·0 cites·17 claims
- 0781US8642119B2Method and system for shielding semiconductor devices from lightWONG WINGSHENQ·Filed 2010·Granted Feb 4, 2014·4 cites·23 claims
- 0879US11226399B2Proximity sensor with integrated ALSST MICROELECTRONICS PTE LTD·Filed 2019·Granted Jan 18, 2022·2 cites·20 claims
- 0978US8492181B2Embedded wafer level optical package structure and manufacturing methodRAMASAMY ANANDAN·Filed 2011·Granted Jul 23, 2013·9 cites·21 claims
- 1076US11828875B2Proximity sensor with integrated ALSST MICROELECTRONICS PTE LTD·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 1176US11193821B2Ambient light sensor with light protectionST MICROELECTRONICS PTE LTD·Filed 2018·Granted Dec 7, 2021·2 cites·20 claims
- 1273US10763194B2Package with lead frame with improved lead design for discrete electrical components and manufacturing the sameST MICROELECTRONICS INC·Filed 2017·Granted Sep 1, 2020·2 cites·20 claims
- 1369US12136608B2Multi-chip packageST MICROELECTRONICS PTE LTD·Filed 2023·Granted Nov 5, 2024·0 cites·20 claims
- 1469US11942496B2Slanted glass edge for image sensor packageST MICROELECTRONICS PTE LTD·Filed 2021·Granted Mar 26, 2024·0 cites·32 claims
- 1569US10422860B2Proximity sensor with integrated ALSST MICROELECTRONICS PTE LTD·Filed 2017·Granted Sep 24, 2019·1 cites·20 claims
- 1667US2025311457A1Sensor die packageST MICROELECTRONICS LTD·Filed 2025·Application pending·0 cites
- 1765US11996397B2Wafer level proximity sensorST MICROELECTRONICS PTE LTD·Filed 2021·Granted May 28, 2024·0 cites·22 claims
- 1864US11581289B2Multi-chip packageST MICROELECTRONICS PTE LTD·Filed 2020·Granted Feb 14, 2023·0 cites·19 claims
- 1964US11562937B2Semiconductor package with protected sidewall and method of forming the sameST MICROELECTRONICS PTE LTD·Filed 2021·Granted Jan 24, 2023·0 cites·19 claims
- 2061US11585847B2Crack detection integrity checkST MICROELECTRONICS PTE LTD·Filed 2022·Granted Feb 21, 2023·0 cites·19 claims
- 2159US2024145258A1Panel level semiconductor package and method of manufacturing the sameST MICROELECTRONICS PTE LTD·Filed 2023·Application pending·0 cites
- 2257US12364038B2Sensor die packageST MICROELECTRONICS LTD·Filed 2021·Granted Jul 15, 2025·0 cites·19 claims
- 2356US7183367B2Vinyl sulphone modified polymerORGANON NV·Filed 2004·Granted Feb 27, 2007·4 cites·11 claims
- 2455US2023230949A1Semiconductor package with exposed electrical contactsST MICROELECTRONICS PTE LTD·Filed 2023·Application pending·0 cites
- 2553US11581280B2WLCSP package with different solder volumesST MICROELECTRONICS PTE LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 2652US11366156B2Crack detection integrity checkST MICROELECTRONICS PTE LTD·Filed 2020·Granted Jun 21, 2022·0 cites·10 claims
- 2752US11270946B2Package with electrical interconnection bridgeST MICROELECTRONICS PTE LTD·Filed 2020·Granted Mar 8, 2022·0 cites·20 claims
- 2852US10910287B2Semiconductor package with protected sidewall and method of forming the sameST MICROELECTRONICS PTE LTD·Filed 2019·Granted Feb 2, 2021·0 cites·12 claims
- 2950US9671671B2Optical assembly including electrically conductive coupling member and related methodsST MICROELECTRONICS PTE LTD·Filed 2013·Granted Jun 6, 2017·0 cites·18 claims
- 3050US2024332436A1Optical sensor package with light shielding materialST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 3149US2024332328A1Optical sensor package with light shielding materialST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 3248US11502029B2Thin semiconductor chip using a dummy sidewall layerST MICROELECTRONICS PTE LTD·Filed 2020·Granted Nov 15, 2022·0 cites·19 claims
- 3346US11527511B2Electronic device comprising a support substrate and stacked electronic chipsST MICROELECTRONICS PTE LTD·Filed 2019·Granted Dec 13, 2022·0 cites·6 claims
- 3446US9768216B2Image sensor device with different width cell layers and related methodsST MICROELECTRONICS PTE LTD·Filed 2014·Granted Sep 19, 2017·0 cites·23 claims
- 3545US11742437B2WLCSP with transparent substrate and method of manufacturing the sameST MICROELECTRONICS LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 3645US6486354B1Solid phase supportsAKZO NOBEL NV·Filed 1998·Granted Nov 26, 2002·7 cites·1 claims
- 3743US11908831B2Method for manufacturing a wafer level chip scale package (WLCSP)ST MICROELECTRONICS PTE LTD·Filed 2021·Granted Feb 20, 2024·0 cites·19 claims
- 3841US2015138420A1Liquid crystal cell connection to lens mount of camera moduleST MICROELECTRONICS PTE LTD·Filed 2013·Application pending·0 cites
- 3941US2019319157A1Electronic device comprising electronic chipsST MICROELECTRONICS GRENOBLE 2·Filed 2019·Application pending·0 cites
- 4039US9525094B2Proximity and ranging sensorST MICROELECTRONICS PTE LTD·Filed 2015·Granted Dec 20, 2016·0 cites·20 claims
- 4137US9244334B2Contact having an angled portionST MICROELECTRONICS PTE LTD·Filed 2013·Granted Jan 26, 2016·0 cites·44 claims
- 4236US2003138846A1Solid phase supportsFiled 2002·Application pending·0 cites
- 4334US2017186644A1Method for making an integrated circuit (ic) package with an electrically conductive shield layerST MICROELECTRONICS PTE LTD·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when David Gani files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →