Inventor · disambiguated record
David Gibson
Also filed as: GIBSON DAVID · GIBSON DAVID I
18 granted patents·6 pending applications·1,252 citations·filing 1979–2014
96Inventor score
Top patents by PatentIndex Score
24 records- 0198US7939934B2Microelectronic packages and methods thereforTESSERA INC·Filed 2005·Granted May 10, 2011·87 cites·45 claims
- 0297US7589409B2Stacked packages and microelectronic assemblies incorporating the sameTESSERA INC·Filed 2007·Granted Sep 15, 2009·113 cites·8 claims
- 0397US6977440B2Stacked packagesTESSERA INC·Filed 2003·Granted Dec 20, 2005·168 cites·33 claims
- 0496US7294928B2Components, methods and assemblies for stacked packagesTESSERA INC·Filed 2003·Granted Nov 13, 2007·151 cites·26 claims
- 0596US6054756AConnection components with frangible leads and busTESSERA INC·Filed 1999·Granted Apr 25, 2000·229 cites·9 claims
- 0694US7335995B2Microelectronic assembly having array including passive elements and interconnectsTESSERA INC·Filed 2005·Granted Feb 26, 2008·35 cites·17 claims
- 0794US7183643B2Stacked packages and systems incorporating the sameTESSERA INC·Filed 2004·Granted Feb 27, 2007·74 cites·50 claims
- 0894US6897565B2Stacked packagesTESSERA INC·Filed 2002·Granted May 24, 2005·101 cites·31 claims
- 0992US7149095B2Stacked microelectronic assembliesTESSERA INC·Filed 2002·Granted Dec 12, 2006·65 cites·35 claims
- 1090US7061122B2Components, methods and assemblies for multi-chip packagesTESSERA INC·Filed 2003·Granted Jun 13, 2006·44 cites·27 claims
- 1190US5915752AMethod of making connections to a semiconductor chip assemblyTESSERA INC·Filed 1993·Granted Jun 29, 1999·89 cites·20 claims
- 1284US6913949B2Stacked packagesTESSERA INC·Filed 2004·Granted Jul 5, 2005·35 cites·13 claims
- 1378US7935569B2Components, methods and assemblies for stacked packagesTESSERA INC·Filed 2007·Granted May 3, 2011·7 cites·16 claims
- 1476US9437582B2Stacked microelectronic assembliesTESSERA INC·Filed 2014·Granted Sep 6, 2016·2 cites·20 claims
- 1571US6081035AMicroelectronic bond ribbon designTESSERA INC·Filed 1996·Granted Jun 27, 2000·42 cites·30 claims
- 1666US8704351B2Stacked microelectronic assembliesGIBSON DAVID·Filed 2009·Granted Apr 22, 2014·2 cites·20 claims
- 1758USD276090SContainer for carrying articlesNESTIER CANADA INC·Filed 1979·Granted Oct 23, 1984·6 cites·1 claims
- 1849US2007166876A1Components, methods and assemblies for multi-chip packagesTESSERA INC·Filed 2006·Application pending·0 cites
- 1949US2006033216A1Stacked packagesTESSERA INC·Filed 2005·Application pending·0 cites
- 2047US6888229B2Connection components with frangible leads and busTESSERA INC·Filed 2004·Granted May 3, 2005·2 cites·26 claims
- 2145US2006278997A1Soldered assemblies and methods of making the sameTESSERA INC·Filed 2005·Application pending·0 cites
- 2241US2006278962A1Microelectronic loop packagesTESSERA INC·Filed 2005·Application pending·0 cites
- 2339US2005280134A1Multi-frequency noise suppression capacitor setTESSERA INC·Filed 2005·Application pending·0 cites
- 2436US2002151111A1P-connection components with frangible leads and busTESSERA INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →