Inventor · disambiguated record
David Hartke
Also filed as: HARTKE DAVID · HARTKE DAVID H
23 granted patents·8 pending applications·1,694 citations·filing 1977–2010
97Inventor score
Top patents by PatentIndex Score
31 records- 0198US7881072B2System and method for processor power delivery and thermal managementMOLEX INC·Filed 2006·Granted Feb 1, 2011·73 cites·23 claims
- 0297US6304450B1Inter-circuit encapsulated packagingINCEP TECHNOLOGIES INC·Filed 1999·Granted Oct 16, 2001·244 cites·14 claims
- 0396US4412285AMultiprocessor intercommunication system and methodTERADATA CORP·Filed 1981·Granted Oct 25, 1983·253 cites·155 claims
- 0493US6452113B2Apparatus for providing power to a microprocessor with integrated thermal and EMI managementINCEP TECHNOLOGIES INC·Filed 2001·Granted Sep 17, 2002·88 cites·51 claims
- 0591US6356448B1Inter-circuit encapsulated packaging for power deliveryINCEPTECHNOLOGIES INC·Filed 1999·Granted Mar 12, 2002·147 cites·24 claims
- 0690US4925311ADynamically partitionable parallel processorsTERADATA CORP·Filed 1986·Granted May 15, 1990·238 cites·20 claims
- 0789US6452804B1Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plateINCEP TECHNOLOGIES INC·Filed 2001·Granted Sep 17, 2002·45 cites·20 claims
- 0889US4391490AInterface for proximity coupled electro-optic devicesXEROX CORP·Filed 1981·Granted Jul 5, 1983·69 cites·6 claims
- 0989US4110823ASoft display word processing system with multiple autonomous processorsXEROX CORP·Filed 1977·Granted Aug 29, 1978·76 cites·1 claims
- 1088US6618268B2Apparatus for delivering power to high performance electronic assembliesINCEP TECHNOLOGIES INC·Filed 2001·Granted Sep 9, 2003·80 cites·14 claims
- 1188US4115765AAutonomous display processorXEROX CORP·Filed 1977·Granted Sep 19, 1978·41 cites·5 claims
- 1287US6847529B2Ultra-low impedance power interconnection system for electronic packagesINCEP TECHNOLOGIES INC·Filed 2001·Granted Jan 25, 2005·42 cites·37 claims
- 1385US6556455B2Ultra-low impedance power interconnection system for electronic packagesINCEP TECHNOLOGIES INC·Filed 2001·Granted Apr 29, 2003·47 cites·27 claims
- 1485US4149145AFax processorXEROX CORP·Filed 1977·Granted Apr 10, 1979·38 cites·4 claims
- 1584US6623279B2Separable power delivery connectorINCEP TECHNOLOGIES INC·Filed 2002·Granted Sep 23, 2003·42 cites·63 claims
- 1683US7245507B2Method and apparatus for providing power to a microprocessor with integrated thermal and EMI managementDIBENE II JOSEPH T·Filed 2002·Granted Jul 17, 2007·33 cites·14 claims
- 1780US6947293B2Method and apparatus for providing power to a microprocessor with integrated thermal and EMI managementINCEP TECHNOLOGIES·Filed 2002·Granted Sep 20, 2005·29 cites·20 claims
- 1876US6845013B2Right-angle power interconnect electronic packaging assemblyINCEP TECHNOLOGIES INC·Filed 2003·Granted Jan 18, 2005·27 cites·13 claims
- 1976US6741480B2Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systemsINCEP TECHNOLOGIES INC·Filed 2001·Granted May 25, 2004·23 cites·17 claims
- 2073US5969579AECL pulse amplitude modulated encoder driver circuitNCR CORP·Filed 1997·Granted Oct 19, 1999·28 cites·8 claims
- 2156US4370029ADielectric interface for proximity coupled electro-optic devicesXEROX CORP·Filed 1980·Granted Jan 25, 1983·16 cites·10 claims
- 2254US2010325882A1System And Method For Processor Power Delivery And Thermal ManagementMOLEX INC·Filed 2010·Application pending·0 cites
- 2354US2007268677A1System and method for processor power delivery and thermal managementMOLEX INC·Filed 2007·Application pending·0 cites
- 2448US4947807AInternal combustion engineOUTBOARD MARINE CORP·Filed 1988·Granted Aug 14, 1990·11 cites·26 claims
- 2547US2005277310A1System and method for processor power delivery and thermal managementMOLEX INC·Filed 2005·Application pending·0 cites
- 2642US2003214800A1System and method for processor power delivery and thermal managementFiled 2003·Application pending·0 cites
- 2740US2003156400A1Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI managementFiled 2003·Application pending·0 cites
- 2838US2001038527A1Inter-circuit encapsulated packagingINCEP TECHNOLOGIES INC·Filed 2001·Application pending·0 cites
- 2937US4162541AApparatus for overscribing binary data of a selected polarity into a semiconductor storeXEROX CORP·Filed 1977·Granted Jul 24, 1979·4 cites·2 claims
- 3037US2002151195A1Power interconnect method utilizing a flexible circuit between a voltage regulation module and an integrated circuit substrateINCEP TECHNOLOGIES INC·Filed 2002·Application pending·0 cites
- 3137US2002008963A1Inter-circuit encapsulated packagingFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when David Hartke files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →