Inventor · disambiguated record
David Huitink
Also filed as: HUITINK DAVID · HUITINK DAVID RYAN
3 granted patents·6 pending applications·5 citations·filing 2015–2024
56Inventor score
Top patents by PatentIndex Score
9 records- 0180US11071234B2Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics coolingUNIV ARKANSAS·Filed 2019·Granted Jul 20, 2021·5 cites·8 claims
- 0268US2023413467A1Power conversion moduleTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0364US11935810B2Chip warpage reduction via raised free bending and re-entrant (auxetic) trace geometriesUNIV ARKANSAS·Filed 2021·Granted Mar 19, 2024·0 cites·8 claims
- 0461US11751353B2Power conversion module and method of forming the sameTEXAS INSTRUMENTS INC·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 0560US2025079384A1Compliant electrical interconnect arrays using copper nano-wires (cunws) in polymeric pre-form attachment layerUNIV ARKANSAS·Filed 2024·Application pending·0 cites
- 0660US2020126891A1Combined Integration Of Phase Change Materials Into Conduction-Convection-Latent Heat Optimized Thermal Management Through Novel Geometries Enabled In Additive Manufactured Heat SinksUNIV ARKANSAS·Filed 2019·Application pending·0 cites
- 0753US2021293490A1Combined Integration Of Phase Change Materials Into Conduction-Convection-Latent Heat Optimized Thermal Management Through Novel Geometries Enabled In Additive Manufactured Heat SinksUNIV ARKANSAS·Filed 2021·Application pending·0 cites
- 0844US2019252291A1Chip Warpage Reduction Via Raised Free Bending & Re-entrant (Auxetic) Trace GeometriesUNIV ARKANSAS·Filed 2019·Application pending·0 cites
- 0926US2017092618A1Package topside ball grid array for ultra low z-heightINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →