Inventor · disambiguated record
Daigo Ichikawa
Also filed as: ICHIKAWA DAIGO
3 granted patents·1 pending application·0 citations·filing 2017–2023
39Inventor score
Top patents by PatentIndex Score
4 records- 0157US11780035B2Solder composition and electronic substrateTAMURA SEISAKUSHO KK·Filed 2021·Granted Oct 10, 2023·0 cites·10 claims
- 0254US12454030B2Solder composition and method for manufacturing flexible circuit boardTAMURA SEISAKUSHO KK·Filed 2022·Granted Oct 28, 2025·0 cites·10 claims
- 0349US2024167828A1Information display deviceTOYOTA MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 0433US10449638B2Solder composition and electronic boardTAMURA SEISAKUSHO KK·Filed 2017·Granted Oct 22, 2019·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →