Inventor · disambiguated record
Dai Ishikawa
Also filed as: ISHIKAWA DAI
49 granted patents·10 pending applications·5,074 citations·filing 1999–2022
98Inventor score
Top patents by PatentIndex Score
59 records- 0198US10480064B2Reaction chamber passivation and selective deposition of metallic filmsASM IP HOLDING BV·Filed 2018·Granted Nov 19, 2019·47 cites·20 claims
- 0298US10468251B2Method for forming spacers using silicon nitride film for spacer-defined multiple patterningASM IP HOLDING BV·Filed 2017·Granted Nov 5, 2019·379 cites·9 claims
- 0398US10041166B2Reaction chamber passivation and selective deposition of metallic filmsASM IP HOLDING BV·Filed 2017·Granted Aug 7, 2018·57 cites·20 claims
- 0498US10014212B2Selective deposition of metallic filmsASM IP HOLDING BV·Filed 2017·Granted Jul 3, 2018·397 cites·18 claims
- 0598US9803277B1Reaction chamber passivation and selective deposition of metallic filmsASM IP HOLDING BV·Filed 2016·Granted Oct 31, 2017·87 cites·19 claims
- 0698US9805974B1Selective deposition of metallic filmsASM IP HOLDING BV·Filed 2016·Granted Oct 31, 2017·66 cites·21 claims
- 0798US9754779B1Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenchesASM IP HOLDING BV·Filed 2016·Granted Sep 5, 2017·484 cites·15 claims
- 0898US9478414B2Method for hydrophobization of surface of silicon-containing film by ALDASM IP HOLDING BV·Filed 2014·Granted Oct 25, 2016·465 cites·6 claims
- 0998US8785215B2Method for repairing damage of dielectric film by cyclic processesASM IP HOLDING BV·Filed 2013·Granted Jul 22, 2014·521 cites·26 claims
- 1097US9190263B2Method for forming SiOCH film using organoaminosilane annealingASM IP HOLDING BV·Filed 2013·Granted Nov 17, 2015·518 cites·15 claims
- 1197US9029272B1Method for treating SiOCH film with hydrogen plasmaASM IP HOLDING BV·Filed 2013·Granted May 12, 2015·526 cites·17 claims
- 1297US8664627B1Method for supplying gas with flow rate gradient over substrateISHIKAWA DAI·Filed 2012·Granted Mar 4, 2014·518 cites·20 claims
- 1396US10793946B1Reaction chamber passivation and selective deposition of metallic filmsASM IP HOLDING BV·Filed 2019·Granted Oct 6, 2020·17 cites·21 claims
- 1496US10410857B2Formation of SiN thin filmsASM IP HOLDING BV·Filed 2015·Granted Sep 10, 2019·13 cites·10 claims
- 1595US10529554B2Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenchesASM IP HOLDING BV·Filed 2017·Granted Jan 7, 2020·377 cites·13 claims
- 1695US9353441B2Heating/cooling pedestal for semiconductor-processing apparatusASM IP HOLDING BV·Filed 2012·Granted May 31, 2016·466 cites·17 claims
- 1788US11784043B2Formation of SiN thin filmsASM IP HOLDING BV·Filed 2021·Granted Oct 10, 2023·1 cites·20 claims
- 1888US11133181B2Formation of SiN thin filmsASM IP HOLDING BV·Filed 2019·Granted Sep 28, 2021·3 cites·20 claims
- 1987US9947582B1Processes for preventing oxidation of metal thin filmsASM IP HOLDING BV·Filed 2017·Granted Apr 17, 2018·5 cites·21 claims
- 2082US10811256B2Method for etching a carbon-containing featureASM IP HOLDING BV·Filed 2018·Granted Oct 20, 2020·3 cites·19 claims
- 2181US11676812B2Method for forming silicon nitride film selectively on top/bottom portionsASM IP HOLDING BV·Filed 2020·Granted Jun 13, 2023·1 cites·10 claims
- 2279US6388951B1Audio apparatusPIONEER CORP·Filed 1999·Granted May 14, 2002·78 cites·11 claims
- 2378US10363608B2Copper paste for joining, method for producing joined body, and method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jul 30, 2019·3 cites·9 claims
- 2475US12233460B2Copper paste, wick formation method, and heat pipeRESONAC CORP·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 2574US7211497B2Method for fabricating semiconductor devicesRENESAS TECH CORP·Filed 2003·Granted May 1, 2007·13 cites·18 claims
- 2673US11462502B2Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 4, 2022·2 cites·20 claims
- 2773US11370066B2Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jun 28, 2022·2 cites·20 claims
- 2872US10720322B2Method for forming silicon nitride film selectively on top surfaceASM IP HOLDING BV·Filed 2018·Granted Jul 21, 2020·1 cites·5 claims
- 2970US8852463B2Metal fine particle for conductive metal paste, conductive metal paste and metal filmISHIKAWA DAI·Filed 2010·Granted Oct 7, 2014·1 cites·18 claims
- 3067US9309119B2Producing method of metal fine particles or metal oxide fine particles, metal fine particles or metal oxide fine particles, and metal-containing paste, and metal film or metal oxide filmHAYASHI YAMATO·Filed 2011·Granted Apr 12, 2016·2 cites·5 claims
- 3166US10930612B2Copper paste for pressureless bonding, bonded body and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 23, 2021·1 cites·9 claims
- 3265US11532588B2Copper paste for pressureless bonding, bonded body and semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·7 claims
- 3365US10910262B2Method of selectively depositing a capping layer structure on a semiconductor device structureASM IP HOLDING BV·Filed 2017·Granted Feb 2, 2021·1 cites·22 claims
- 3463US8304654B2Coaxial cableABE TOMIYA·Filed 2009·Granted Nov 6, 2012·2 cites·10 claims
- 3563US6794257B2Method of manufacturing a semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2003·Granted Sep 21, 2004·6 cites·19 claims
- 3661US8816207B2Coaxial cable and manufacturing method of the sameABE TOMIYA·Filed 2009·Granted Aug 26, 2014·2 cites·8 claims
- 3760US7262101B2Method of manufacturing a semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Aug 28, 2007·5 cites·19 claims
- 3858US2024181575A1Copper paste for forming sintered copper pillars and method for producing bonded bodyRESONAC CORP·Filed 2022·Application pending·0 cites
- 3954US7662696B2Method for fabricating semiconductor devicesRENESAS TECH CORP·Filed 2007·Granted Feb 16, 2010·0 cites·6 claims
- 4052US2024424614A1Metal paste for bonding, and bonded body and method for producing sameRESONAC CORP·Filed 2022·Application pending·0 cites
- 4152US2024300055A1Metal paste for joining, joint, and manufacturing method thereforRESONAC CORP·Filed 2022·Application pending·0 cites
- 4251US10566304B2Assembly and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Feb 18, 2020·0 cites·9 claims
- 4350US10201879B2Silver paste composition and semiconductor device using sameHITACHI CHEMICAL CO LTD·Filed 2013·Granted Feb 12, 2019·0 cites·26 claims
- 4450US2006275991A1Method of manufacturing a semiconductor integrated circuit deviceISHIKAWA DAI·Filed 2006·Application pending·0 cites
- 4549US8163999B2Insulation-coated wireABE TOMIYA·Filed 2009·Granted Apr 24, 2012·0 cites·10 claims
- 4648US2021175052A1Substrate processing apparatus, bevel mask and substrate processing methodASM IP HOLDING BV·Filed 2020·Application pending·0 cites
- 4747US2013074728A1Metal microparticles and method for producing the same, metal paste containing the metal microparticles, and metal coat made of the metal pasteHITACHI CABLE·Filed 2012·Application pending·0 cites
- 4846US10174226B2Adhesive composition and semiconductor device using sameHITACHI CHEMICAL CO LTD·Filed 2013·Granted Jan 8, 2019·0 cites·20 claims
- 4946US2013209803A1Crosslinked rubber, rubber-sheathed cable using same, and crosslinked rubber producing methodHITACHI CABLE·Filed 2013·Application pending·0 cites
- 5045US10658181B2Method of spacer-defined direct patterning in semiconductor fabricationASM IP HOLDING BV·Filed 2018·Granted May 19, 2020·0 cites·20 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →