Inventor · disambiguated record
David Johnson
Also filed as: JOHNSON DAVID · JOHNSON DAVID J · JOHNSON DAVID R · JOHNSON DAVID RAY
77 granted patents·18 pending applications·1,391 citations·filing 1976–2022
99Inventor score
Top patents by PatentIndex Score
95 records- 0197US5089463AHydrodemetalation and hydrodesulfurization catalyst of specified macroporosityCHEVRON RES & TECH·Filed 1990·Granted Feb 18, 1992·187 cites·13 claims
- 0297US4976848AHydrodemetalation and hydrodesulfurization using a catalyst of specified macroporosityCHEVRON RES·Filed 1988·Granted Dec 11, 1990·135 cites·14 claims
- 0395US8802545B2Method and apparatus for plasma dicing a semi-conductor waferJOHNSON CHRIS·Filed 2012·Granted Aug 12, 2014·15 cites·5 claims
- 0495US8785332B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Jul 22, 2014·15 cites·2 claims
- 0595US7585554B2Wound dressing, ingredient delivery device and IV hold-down incorporating a statically retained handleCORIUM INT INC·Filed 2005·Granted Sep 8, 2009·36 cites·18 claims
- 0693US8778806B2Method and apparatus for plasma dicing a semi-conductor waferJOHNSON CHRIS·Filed 2012·Granted Jul 15, 2014·10 cites·12 claims
- 0792US5472928ACatalyst, method and apparatus for an on-stream particle replacement system for countercurrent contact of a gas and liquid feed stream with a packed bedFiled 1994·Granted Dec 5, 1995·73 cites·69 claims
- 0891US9711406B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA-THERM LLC·Filed 2016·Granted Jul 18, 2017·6 cites·7 claims
- 0991US8691702B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Apr 8, 2014·13 cites·6 claims
- 1091US4737123AConnector assembly for packaged microwave integrated circuitsWATKINS JOHNSON CO·Filed 1987·Granted Apr 12, 1988·132 cites·2 claims
- 1190US6605206B1Process for increasing the yield of lubricating base oil from a Fischer-Tropsch plantCHEVRON USA INC·Filed 2002·Granted Aug 12, 2003·58 cites·35 claims
- 1288US6703535B2Process for upgrading fischer-tropsch syncrude using thermal cracking and oligomerizationCHEVRON USA INC·Filed 2002·Granted Mar 9, 2004·40 cites·40 claims
- 1386US6838390B2Method and apparatus for plasma etching a waferMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 4, 2005·32 cites·6 claims
- 1483US9070760B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Jun 30, 2015·3 cites·21 claims
- 1580US8796154B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Aug 5, 2014·2 cites·11 claims
- 1680US7332073B2Process for removing contaminants from Fischer-Tropsch feed streamsCHEVRON USA INC·Filed 2004·Granted Feb 19, 2008·10 cites·22 claims
- 1779US6268203B1Biological control of purple loosestrifeUNIV MINNESOTA·Filed 1999·Granted Jul 31, 2001·30 cites·41 claims
- 1879US4896437AInsulated boot and gaiter combinationJOHNSON DAVID R·Filed 1985·Granted Jan 30, 1990·96 cites·6 claims
- 1978US6702937B2Process for upgrading Fischer-Tropsch products using dewaxing and hydrofinishingCHEVRON USA INC·Filed 2002·Granted Mar 9, 2004·21 cites·17 claims
- 2078US4790367AMethods for preparing a formed cellular plastic material pattern employed in metal castingDOW CHEMICAL CO·Filed 1988·Granted Dec 13, 1988·14 cites·36 claims
- 2177US9911654B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2016·Granted Mar 6, 2018·1 cites·8 claims
- 2277US6509960B2Method and apparatus employing external light source for endpoint detectionMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 21, 2003·21 cites·42 claims
- 2376US9564366B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA-THERM LLC·Filed 2015·Granted Feb 7, 2017·1 cites·3 claims
- 2475US7713432B2Method and apparatus to improve plasma etch uniformityJOHNSON DAVID·Filed 2005·Granted May 11, 2010·3 cites·12 claims
- 2574US6369887B2Method and apparatus for automated, in situ material detection using filtered fluoresced, reflected, or absorbed lightMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 9, 2002·9 cites·17 claims
- 2673US8980764B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Mar 17, 2015·1 cites·5 claims
- 2773US6700027B1Process for the oligomerization of olefins in Fischer-Tropsch condensate using chromium catalyst and high temperatureCHEVRON USA INC·Filed 2002·Granted Mar 2, 2004·17 cites·18 claims
- 2872US9105705B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Aug 11, 2015·1 cites·26 claims
- 2971US4789462AReverse-graded catalyst systems for hydrodemetalation and hydrodesulfurizationCHEVRON RES·Filed 1986·Granted Dec 6, 1988·30 cites·27 claims
- 3070US5733440ACatalyst, method and apparatus for an on-stream particle replacement system for countercurrent contact of a gas and liquid feed stream with a packed bedCHEVRON USA INC·Filed 1996·Granted Mar 31, 1998·26 cites·20 claims
- 3170US4579872AUniform minimization of plastic foam cell sizeDOW CHEMICAL CO·Filed 1985·Granted Apr 1, 1986·25 cites·9 claims
- 3270US4219401AMetal electrowinning feed cathodeD H TITANIUM CO THE·Filed 1978·Granted Aug 26, 1980·16 cites·16 claims
- 3369US7047553B1Method and apparatus for decreasing cable installation time and cable installation faultsARRIS INT INC·Filed 2000·Granted May 16, 2006·9 cites·27 claims
- 3469US5368889AMethod of making thin film composite membranesDOW CHEMICAL CO·Filed 1993·Granted Nov 29, 1994·36 cites·11 claims
- 3568US11488865B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2019·Granted Nov 1, 2022·0 cites·8 claims
- 3667US10707060B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2018·Granted Jul 7, 2020·0 cites·12 claims
- 3766US6457978B1Method and apparatus for arranging cable connectors to allow for easier cable installationCADENT INC·Filed 2001·Granted Oct 1, 2002·19 cites·7 claims
- 3865US10741447B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA-THERM LLC·Filed 2018·Granted Aug 11, 2020·0 cites·14 claims
- 3964US7829465B2Method for plasma etching of positively sloped structuresLAI SHOULIANG·Filed 2007·Granted Nov 9, 2010·3 cites·26 claims
- 4063US7888546B2Wound dressing, ingredient delivery device and IV hold-down, and method relating to sameCORIUM INT INC·Filed 2004·Granted Feb 15, 2011·20 cites·31 claims
- 4163US6179448B1Automated light tunerMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 30, 2001·26 cites·40 claims
- 4263US5969805AMethod and apparatus employing external light source for endpoint detectionMICRON TECHNOLOGY INC·Filed 1997·Granted Oct 19, 1999·22 cites·42 claims
- 4362US12489018B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2022·Granted Dec 2, 2025·0 cites·8 claims
- 4462US5599440ACatalyst method and apparatus for an on-stream particle replacement system for countercurrent contact of a gas and liquid feed stream with a packed bedCHEVRON USA INC·Filed 1995·Granted Feb 4, 1997·18 cites·69 claims
- 4561US10297427B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2015·Granted May 21, 2019·0 cites·6 claims
- 4661US9202721B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2014·Granted Dec 1, 2015·0 cites·7 claims
- 4761US7102737B2Method and apparatus for automated, in situ material detection using filtered fluoresced, reflected, or absorbed lightMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 5, 2006·4 cites·59 claims
- 4860US9202720B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Dec 1, 2015·0 cites·5 claims
- 4959US9496177B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA-THERM LLC·Filed 2015·Granted Nov 15, 2016·0 cites·6 claims
- 5059US6080272AMethod and apparatus for plasma etching a waferMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 27, 2000·17 cites·14 claims
Showing the top 50 of 95 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →