Inventor · disambiguated record
David B. Kerwin
Also filed as: KERWIN DAVID · KERWIN DAVID B
18 granted patents·3 pending applications·87 citations·filing 1997–2016
92Inventor score
Files withAEROFLEX COLORADO SPRINGS INC9KERWIN DAVID B6AEROFLEX UTMC MICROELECTRONIC2AEROFLEX UTMC MICROELECTRONICS2KERWIN DAVID1
Top patents by PatentIndex Score
21 records- 0180US7589327B2Energy sensitive direct conversion radiation detectorAEROFLEX COLORADO SPRINGS INC·Filed 2008·Granted Sep 15, 2009·11 cites·24 claims
- 0279US9396947B2Wafer structure for electronic integrated circuit manufacturingKERWIN DAVID B·Filed 2011·Granted Jul 19, 2016·4 cites·21 claims
- 0379US9312133B2Wafer structure for electronic integrated circuit manufacturingKERWIN DAVID B·Filed 2011·Granted Apr 12, 2016·4 cites·21 claims
- 0478US7544947B2Cross-talk and back side shielding in a front side illuminated photo detector diode arrayAEROFLEX COLORADO SPRINGS INC·Filed 2007·Granted Jun 9, 2009·12 cites·19 claims
- 0564US6917533B2Radiation-hardened programmable deviceAEROFLEX UTMC MICROELECTRONIC·Filed 2001·Granted Jul 12, 2005·13 cites·2 claims
- 0663US9378956B2Wafer structure for electronic integrated circuit manufacturingKERWIN DAVID B·Filed 2011·Granted Jun 28, 2016·1 cites·23 claims
- 0763US9378955B2Wafer structure for electronic integrated circuit manufacturingKERWIN DAVID B·Filed 2011·Granted Jun 28, 2016·1 cites·21 claims
- 0863US6890832B1Radiation hardening method for shallow trench isolation in CMOSAEROFLEX UTMC MICROELECTRONIC·Filed 2002·Granted May 10, 2005·11 cites·37 claims
- 0951US10295412B2Minimal-energy up/down counting apparatus and method for extremely low-power applicationsAEROFLEX COLORADO SPRINGS INC·Filed 2016·Granted May 21, 2019·0 cites·24 claims
- 1051US9786608B2Wafer structure for electronic integrated circuit manufacturingAEROFLEX COLORADO SPRINGS INC·Filed 2016·Granted Oct 10, 2017·0 cites·7 claims
- 1150US7656699B2Radiation-hardened programmable deviceAEROFLEX UTMC MICROELECTRONICS·Filed 2007·Granted Feb 2, 2010·0 cites·6 claims
- 1249US9799516B2Wafer structure for electronic integrated circuit manufacturingAEROFLEX COLORADO SPRINGS INC·Filed 2016·Granted Oct 24, 2017·0 cites·6 claims
- 1349US9799653B2Wafer structure for electronic integrated circuit manufacturingAEROFLEX COLORADO SPRINGS INC·Filed 2016·Granted Oct 24, 2017·0 cites·6 claims
- 1449US9646835B2Wafer structure for electronic integrated circuit manufacturingAEROFLEX COLORADO SPRINGS INC·Filed 2016·Granted May 9, 2017·0 cites·6 claims
- 1548US6855618B2Radiation hardened semiconductor deviceAEROFLEX COLORADO SPRINGS INC·Filed 2002·Granted Feb 15, 2005·2 cites·19 claims
- 1647US7251150B2Radiation-hardened programmable deviceAEROFLEX COLORADO SPRINGS INC·Filed 2005·Granted Jul 31, 2007·1 cites·12 claims
- 1746US6511893B1Radiation hardened semiconductor deviceAEROFLEX UTMC MICROELECTRONICS·Filed 1998·Granted Jan 28, 2003·13 cites·39 claims
- 1841US6063690AMethod for making recessed field oxide for radiation hardened microelectronicsUTMC MICROELECTRONICS SYSTEMS·Filed 1997·Granted May 16, 2000·14 cites·20 claims
- 1939US2013334639A1Photodiode with reduced dead-layer regionKERWIN DAVID·Filed 2012·Application pending·0 cites
- 2037US2013049175A1Wafer structure for electronic integrated circuit manufacturingKERWIN DAVID B·Filed 2011·Application pending·0 cites
- 2137US2013049178A1Wafer structure for electronic integrated circuit manufacturingKERWIN DAVID B·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →