Inventor · disambiguated record
Daeik Daniel Kim
Also filed as: KIM DAEIK · KIM DAEIK D · KIM DAEIK DANIEL
130 granted patents·27 pending applications·475 citations·filing 2005–2023
99Inventor score
Top patents by PatentIndex Score
157 records- 0198US9449753B2Varying thickness inductorQUALCOMM INC·Filed 2014·Granted Sep 20, 2016·33 cites·25 claims
- 0298US9140747B2Sense amplifier offset voltage reductionQUALCOMM INC·Filed 2013·Granted Sep 22, 2015·54 cites·27 claims
- 0396US10468350B2Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 5, 2019·12 cites·20 claims
- 0496US9502586B1Backside coupled symmetric varactor structureQUALCOMM INC·Filed 2015·Granted Nov 22, 2016·13 cites·18 claims
- 0595US9893048B2Passive-on-glass (POG) device and methodQUALCOMM INC·Filed 2015·Granted Feb 13, 2018·7 cites·30 claims
- 0694US10283257B2Skewed co-spiral inductor structureQUALCOMM INC·Filed 2016·Granted May 7, 2019·12 cites·25 claims
- 0794US10242957B2Compartment shielding in flip-chip (FC) moduleQUALCOMM INC·Filed 2015·Granted Mar 26, 2019·13 cites·30 claims
- 0894US9959964B2Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 1, 2018·6 cites·25 claims
- 0993US10373960B2Semiconductor memory devices including separate upper and lower bit line spacersSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 6, 2019·8 cites·21 claims
- 1093US9721946B2Backside coupled symmetric varactor structureQUALCOMM INC·Filed 2016·Granted Aug 1, 2017·7 cites·10 claims
- 1193US9620463B2Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)QUALCOMM INC·Filed 2015·Granted Apr 11, 2017·10 cites·29 claims
- 1292US10978397B2Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 13, 2021·5 cites·16 claims
- 1392US10325855B2Backside drill embedded die substrateQUALCOMM INC·Filed 2016·Granted Jun 18, 2019·10 cites·28 claims
- 1490US10269808B2Semiconductor devices and methods of forming semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 23, 2019·4 cites·19 claims
- 1590US9673275B2Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuitsQUALCOMM INC·Filed 2015·Granted Jun 6, 2017·6 cites·18 claims
- 1690US8524560B2Method of fabricating semiconductor device with vertical channel transistorKIM DAEIK·Filed 2012·Granted Sep 3, 2013·11 cites·10 claims
- 1790US8037340B2Apparatus and method for micro performance tuning of a clocked digital systemIBM·Filed 2007·Granted Oct 11, 2011·23 cites·23 claims
- 1889US10037996B2Semiconductor device includes a substrate having conductive contact structures thereonSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 31, 2018·4 cites·20 claims
- 1989US9960170B1Methods of fabricating memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 1, 2018·6 cites·20 claims
- 2089US9370103B2Low package parasitic inductance using a thru-substrate interposerQUALCOMM INC·Filed 2013·Granted Jun 14, 2016·9 cites·11 claims
- 2188US9929013B2Methods of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 27, 2018·5 cites·20 claims
- 2288US9184136B2Semiconductor devices and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 10, 2015·11 cites·15 claims
- 2387US10559571B2Methods of fabricating semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 11, 2020·4 cites·20 claims
- 2487US10290414B2Substrate comprising an embedded inductor and a thin film magnetic coreQUALCOMM INC·Filed 2015·Granted May 14, 2019·6 cites·20 claims
- 2587US9425761B2High pass filters and low pass filters using through glass via technologyQUALCOMM INC·Filed 2013·Granted Aug 23, 2016·9 cites·21 claims
- 2687US9203373B2Diplexer design using through glass via technologyQUALCOMM INC·Filed 2013·Granted Dec 1, 2015·8 cites·20 claims
- 2786US10069474B2Encapsulation of acoustic resonator devicesQUALCOMM INC·Filed 2016·Granted Sep 4, 2018·4 cites·30 claims
- 2886US10049815B2Nested through glass via transformerQUALCOMM INC·Filed 2016·Granted Aug 14, 2018·2 cites·21 claims
- 2986US9831172B2Semiconductor devices having expanded recess for bit line contactSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 28, 2017·5 cites·17 claims
- 3086US8878273B2Semiconductor memory device including narrower storage node contact plugsKIM DAEIK·Filed 2012·Granted Nov 4, 2014·7 cites·10 claims
- 3185US10535605B2Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 14, 2020·3 cites·18 claims
- 3285US9954267B2Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filterQUALCOMM INC·Filed 2016·Granted Apr 24, 2018·4 cites·25 claims
- 3385US9368566B2Package on package (PoP) integrated device comprising a capacitor in a substrateQUALCOMM INC·Filed 2014·Granted Jun 14, 2016·7 cites·20 claims
- 3485US8859363B2Semiconductor devices including vertical channel transistors and methods of fabricating the sameKIM DAEIK·Filed 2011·Granted Oct 14, 2014·7 cites·18 claims
- 3584US9875848B2MIM capacitor and method of making the sameQUALCOMM INC·Filed 2015·Granted Jan 23, 2018·4 cites·30 claims
- 3683US12069849B2Semiconductor devices and methods of forming semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·19 claims
- 3783US9813043B2Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methodsQUALCOMM INC·Filed 2016·Granted Nov 7, 2017·3 cites·23 claims
- 3883US9768109B2Integrated circuits (ICS) on a glass substrateQUALCOMM INC·Filed 2015·Granted Sep 19, 2017·3 cites·20 claims
- 3983US9368564B23D pillar inductorQUALCOMM INC·Filed 2014·Granted Jun 14, 2016·5 cites·23 claims
- 4083US9355967B2Stress compensation patterningQUALCOMM INC·Filed 2013·Granted May 31, 2016·5 cites·31 claims
- 4183US9275786B2Superposed structure 3D orthogonal through substrate inductorQUALCOMM INC·Filed 2014·Granted Mar 1, 2016·5 cites·23 claims
- 4282US10431511B2Power amplifier with RF structureQUALCOMM INC·Filed 2017·Granted Oct 1, 2019·4 cites·31 claims
- 4382US9966426B2Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 8, 2018·4 cites·20 claims
- 4482US8866219B2Semiconductor device with vertical channel transistor and method of operating the sameKIM DAEIK·Filed 2011·Granted Oct 21, 2014·6 cites·17 claims
- 4581US9679982B2Semiconductor device and method of manufacturing the sameKIM DAEIK·Filed 2014·Granted Jun 13, 2017·5 cites·20 claims
- 4680US9660110B2Varactor device with backside contactQUALCOMM INC·Filed 2014·Granted May 23, 2017·3 cites·30 claims
- 4778US9111960B2Semiconductor devices with vertical channel transistorsKIM HUI-JUNG·Filed 2011·Granted Aug 18, 2015·5 cites·20 claims
- 4877US10832848B2Low DC resistance and high RF resistance power amplifier choke inductorQUALCOMM INC·Filed 2017·Granted Nov 10, 2020·2 cites·19 claims
- 4977US10023627B2Vascular endothelial growth factor fusion proteinKOREA PRIME PHARM CO LTD·Filed 2017·Granted Jul 17, 2018·6 cites·17 claims
- 5076US10418333B1Waveguide along shielded side wallQUALCOMM INC·Filed 2018·Granted Sep 17, 2019·2 cites·15 claims
Showing the top 50 of 157 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →