Inventor · disambiguated record
Daiyu Kondo
Also filed as: KONDO DAIYU
35 granted patents·4 pending applications·71 citations·filing 2005–2024
95Inventor score
Top patents by PatentIndex Score
39 records- 0190US8194407B2Heat radiation material, electronic device and method of manufacturing electronic deviceYAMAGUCHI YOSHITAKA·Filed 2009·Granted Jun 5, 2012·20 cites·7 claims
- 0289US8958207B2Heat radiation material, electronic device and method of manufacturing electronic deviceYAMAGUCHI YOSHITAKA·Filed 2012·Granted Feb 17, 2015·10 cites·7 claims
- 0384US2025196486A1Heat dissipation sheet and method of manufacturing heat dissipation sheetFUJITSU LTD·Filed 2024·Application pending·0 cites
- 0483US7417320B2Substrate structure and manufacturing method of the sameFUJITSU LTD·Filed 2005·Granted Aug 26, 2008·9 cites·13 claims
- 0581US8749979B2Sheet structure and method of manufacturing sheet structureIWAI TAISUKE·Filed 2009·Granted Jun 10, 2014·12 cites·19 claims
- 0679US11264417B2Photo detection element, optical sensor, and method of manufacturing photo detection elementFUJITSU LTD·Filed 2019·Granted Mar 1, 2022·2 cites·18 claims
- 0778US9085831B2Bundle of long thin carbon structures, manufacturing method therefor, and electronic deviceKONDO DAIYU·Filed 2011·Granted Jul 21, 2015·2 cites·11 claims
- 0876US12027441B2Conductive heat radiation film, method of manufacturing the same, and method of manufacturing electronic deviceFUJITSU LTD·Filed 2023·Granted Jul 2, 2024·0 cites·15 claims
- 0973US12234533B2Bonding structure and method of manufacturing bonding structureFUJITSU LTD·Filed 2023·Granted Feb 25, 2025·0 cites·8 claims
- 1073US10770370B2Electronic device and heat dissipating sheetFUJITSU LTD·Filed 2019·Granted Sep 8, 2020·1 cites·5 claims
- 1173US9355916B2Semiconductor manufacturing method and semiconductor deviceFUJITSU LTD·Filed 2015·Granted May 31, 2016·2 cites·11 claims
- 1271US12194724B2Heat dissipation sheet and method of manufacturing heat dissipation sheetFUJITSU LTD·Filed 2020·Granted Jan 14, 2025·0 cites·6 claims
- 1369US8372487B2Carbon nanotube device and manufacturing method of the sameFUJITSU LTD·Filed 2009·Granted Feb 12, 2013·3 cites·8 claims
- 1467US11735493B2Conductive heat radiation film, method of manufacturing the same, and method of manufacturing electronic deviceFUJITSU LTD·Filed 2020·Granted Aug 22, 2023·0 cites·4 claims
- 1567US8029760B2Method of manufacturing carbon nanotubeFUJITSU LTD·Filed 2008·Granted Oct 4, 2011·1 cites·13 claims
- 1666US11967539B2Heat dissipation sheet, manufacturing method of heat dissipation sheet, and electronic apparatusFUJITSU LTD·Filed 2022·Granted Apr 23, 2024·0 cites·10 claims
- 1766US8932904B2Semiconductor device and method of manufacturing the sameKONDO DAIYU·Filed 2012·Granted Jan 13, 2015·1 cites·1 claims
- 1864US11545592B2Photosensor device and method of manufacturing a photosensor deviceFUJITSU LTD·Filed 2021·Granted Jan 3, 2023·0 cites·8 claims
- 1964US7932510B2Carbon nanotube grown on catalyst and manufacture methodFUJITSU LTD·Filed 2008·Granted Apr 26, 2011·1 cites·18 claims
- 2062US10079209B2Graphene film manufacturing method and semiconductor device manufacturing methodFUJITSU LTD·Filed 2015·Granted Sep 18, 2018·1 cites·14 claims
- 2162US8743546B2Sheet structure and method of manufacturing the sameIWAI TAISUKE·Filed 2008·Granted Jun 3, 2014·3 cites·12 claims
- 2260US9385209B2Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2014·Granted Jul 5, 2016·0 cites·5 claims
- 2359US11329183B2Photo detection element, optical sensor, and method of manufacturing photo detection elementFUJITSU LTD·Filed 2019·Granted May 10, 2022·0 cites·17 claims
- 2457US11702725B2Bonding structure and method of manufacturing bonding structureFUJITSU LTD·Filed 2019·Granted Jul 18, 2023·0 cites·8 claims
- 2556US9865699B2Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2016·Granted Jan 9, 2018·0 cites·4 claims
- 2656US8632885B2Bundle of long thin carbon structures, manufacturing method thereof, and electronic deviceKONDO DAIYU·Filed 2007·Granted Jan 21, 2014·1 cites·20 claims
- 2755US8533945B2Wiring structure and method of forming the sameNIHEI MIZUHISA·Filed 2008·Granted Sep 17, 2013·2 cites·8 claims
- 2854US11264302B2Heat dissipation sheet, manufacturing method of heat dissipation sheet, and electronic apparatusFUJITSU LTD·Filed 2018·Granted Mar 1, 2022·0 cites·15 claims
- 2954US10381290B2Method of manufacturing an electronic deviceFUJITSU LTD·Filed 2017·Granted Aug 13, 2019·0 cites·6 claims
- 3053US8350391B2Sheet structure, semiconductor device and method of growing carbon structureFUJITSU LTD·Filed 2012·Granted Jan 8, 2013·0 cites·7 claims
- 3152US8076260B2Substrate structure and manufacturing method of the sameKONDO DAIYU·Filed 2008·Granted Dec 13, 2011·0 cites·14 claims
- 3251US11075139B2Heat radiation structure, electronic device and manufacturing method of heat radiation structureFUJITSU LTD·Filed 2019·Granted Jul 27, 2021·0 cites·15 claims
- 3351US10497639B2Carbon nanotube structure, heat dissipation sheet, and method of manufacturing carbon nanotube structureFUJITSU LTD·Filed 2017·Granted Dec 3, 2019·0 cites·10 claims
- 3449US2018158753A1Heat dissipating structure and manufactureFUJITSU LTD·Filed 2017·Application pending·0 cites
- 3548US8258060B2Sheet structure, semiconductor device and method of growing carbon structureKONDO DAIYU·Filed 2010·Granted Sep 4, 2012·0 cites·12 claims
- 3647US2012325454A1Heat dissipating structure and manufacture thereofIWAI TAISUKE·Filed 2012·Application pending·0 cites
- 3745US2006212974A1Carbon nanotube device and manufacturing method of the sameFUJITSU LTD·Filed 2005·Application pending·0 cites
- 3843US9537075B2Graphite structure, electronic component and method of manufacturing electronic componentKONDO DAIYU·Filed 2011·Granted Jan 3, 2017·0 cites·14 claims
- 3942US9576907B2Wiring structure and method of manufacturing the sameFUJITSU LTD·Filed 2015·Granted Feb 21, 2017·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →