Inventor · disambiguated record
David G. Love
Also filed as: LOVE DAVID · LOVE DAVID G · LOVE DAVID GEORGE
17 granted patents·2 pending applications·1,449 citations·filing 1992–2018
96Inventor score
Top patents by PatentIndex Score
19 records- 0198US5334804AWire interconnect structures for connecting an integrated circuit to a substrateFUJITSU LTD·Filed 1992·Granted Aug 2, 1994·280 cites·25 claims
- 0297US5477160AModule test cardFUJITSU LTD·Filed 1993·Granted Dec 19, 1995·211 cites·23 claims
- 0396US6317326B1Integrated circuit device package and heat dissipation deviceSUN MICROSYSTEMS INC·Filed 2000·Granted Nov 13, 2001·139 cites·17 claims
- 0495US5773889AWire interconnect structures for connecting an integrated circuit to a substrateFUJITSU LTD·Filed 1996·Granted Jun 30, 1998·162 cites·20 claims
- 0593US5515604AMethods for making high-density/long-via laminated connectorsFUJITSU LTD·Filed 1993·Granted May 14, 1996·91 cites·29 claims
- 0692US5514906AApparatus for cooling semiconductor chips in multichip modulesFUJITSU LTD·Filed 1993·Granted May 7, 1996·158 cites·40 claims
- 0789US5536362AWire interconnect structures for connecting an integrated circuit to a substrateFUJITSU LTD·Filed 1994·Granted Jul 16, 1996·85 cites·25 claims
- 0889US5363038AMethod and apparatus for testing an unpopulated chip carrier using a module test cardFUJITSU LTD·Filed 1992·Granted Nov 8, 1994·74 cites·20 claims
- 0986US5404265AInterconnect capacitorsFUJITSU LTD·Filed 1992·Granted Apr 4, 1995·85 cites·16 claims
- 1080US5897341ADiffusion bonded interconnectFUJITSU LTD·Filed 1998·Granted Apr 27, 1999·59 cites·30 claims
- 1178US10679954B2Integrated circuit system with carrier construction configuration and method of manufacture thereofEOPLEX LTD·Filed 2018·Granted Jun 9, 2020·2 cites·20 claims
- 1278US6126059ACaptured-cell solder printing and reflow methods and apparatusesFUJITSU LTD·Filed 1999·Granted Oct 3, 2000·39 cites·19 claims
- 1378US5988487ACaptured-cell solder printing and reflow methodsFUJITSU LTD·Filed 1997·Granted Nov 23, 1999·40 cites·17 claims
- 1470US7754343B2Ternary alloy column grid arrayORACLE AMERICA INC·Filed 2005·Granted Jul 13, 2010·5 cites·6 claims
- 1553US8116097B2Apparatus for electrically coupling a semiconductor package to a printed circuit boardLOVE DAVID G·Filed 2007·Granted Feb 14, 2012·2 cites·18 claims
- 1645US2016190078A1Integrated circuit system with carrier construction configuration and method of manufacture thereofEOPLEX LTD·Filed 2015·Application pending·0 cites
- 1744US2007059548A1Grid array package using tin/silver columnsSUN MICROSYSTEMS INC·Filed 2005·Application pending·0 cites
- 1843US5597412AApparatus for forcing plating solution into via openingsFUJITSU LTD·Filed 1995·Granted Jan 28, 1997·10 cites·2 claims
- 1937US6168971B1Method of assembling thin film jumper connectors to a substrateFUJITSU LTD·Filed 1998·Granted Jan 2, 2001·7 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →