Inventor · disambiguated record
David S. Marx
Also filed as: MARX DAVID S
8 granted patents·3 pending applications·110 citations·filing 2001–2016
85Inventor score
Top patents by PatentIndex Score
11 records- 0193US7477401B2Trench measurement system employing a chromatic confocal height sensor and a microscopeTAMAR TECHNOLOGY INC·Filed 2005·Granted Jan 13, 2009·57 cites·10 claims
- 0289US7738113B1Wafer measurement system and apparatusTAMAR TECHNOLOGY INC·Filed 2007·Granted Jun 15, 2010·29 cites·9 claims
- 0376US9714825B2Wafer shape thickness and trench measurementMARX DAVID S·Filed 2011·Granted Jul 25, 2017·5 cites·19 claims
- 0468US8649016B2System for directly measuring the depth of a high aspect ratio etched feature on a waferMARX DAVID S·Filed 2011·Granted Feb 11, 2014·2 cites·33 claims
- 0564US6782146B2Multiple polarization combiner-splitter-isolator and method of manufacturing the sameCORNING INC·Filed 2001·Granted Aug 24, 2004·10 cites·55 claims
- 0655US9587932B2System for directly measuring the depth of a high aspect ratio etched feature on a waferRUDOLPH TECH INC·Filed 2016·Granted Mar 7, 2017·0 cites·15 claims
- 0755US6710864B1Concentricity measuring instrument for a fiberoptic cable endFiled 2003·Granted Mar 23, 2004·7 cites·14 claims
- 0854US2014110582A1System for directly measuring the depth of a high aspect ratio etched feature on a waferRUDOLPH TECHNOLOGIES INC·Filed 2013·Application pending·0 cites
- 0943US9952041B2Assessing alignment of top and bottom ends of TSVs and characterizing microfabrication processRUDOLPH TECH INC·Filed 2014·Granted Apr 24, 2018·0 cites·9 claims
- 1043US2007148792A1Wafer measurement system and apparatusMARX DAVID S·Filed 2006·Application pending·0 cites
- 1139US2010321671A1System for directly measuring the depth of a high aspect ratio etched feature on a waferMARX DAVID S·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →