Inventor · disambiguated record
Daisaku Matsukawa
Also filed as: MATSUKAWA DAISAKU
3 granted patents·4 pending applications·0 citations·filing 2016–2025
41Inventor score
Top patents by PatentIndex Score
7 records- 0182US2025362601A1Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic ComponentHD MICROSYSTEMS LTD·Filed 2025·Application pending·0 cites
- 0260US12386257B2Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic componentHD MICROSYSTEMS LTD·Filed 2020·Granted Aug 12, 2025·0 cites·15 claims
- 0348US2025233103A1Method of manufacturing semiconductor device, hybrid bonding insulation film forming material and semiconductor deviceHD MICROSYSTEMS LTD·Filed 2023·Application pending·0 cites
- 0448US2025201760A1Hybrid bonding insulation membrane forming material, method of producing semiconductor device and semiconductor deviceHD MICROSYSTEMS LTD·Filed 2023·Application pending·0 cites
- 0539US2024092973A1Polyimide precursor, resin composition, photosensitive resin composition, method for manufacturing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface-protective film, and electronic componentHD MICROSYSTEMS LTD·Filed 2019·Application pending·0 cites
- 0634US11048167B2Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic componentHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2016·Granted Jun 29, 2021·0 cites·9 claims
- 0731US11592744B2Positive-type photosensitive resin compositionHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2016·Granted Feb 28, 2023·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →