Inventor · disambiguated record
Daniel Maurer
Also filed as: MAURER DANIEL · MAURER DANIEL P
14 granted patents·4 pending applications·34 citations·filing 1991–2023
88Inventor score
Files withINFINEON TECHNOLOGIES AG10INFINEON TECHNOLOGIES AUSTRIA AG2MAURER DANIEL2ANLIKER CHRISTOPH1DENIFL GUENTER1
Top patents by PatentIndex Score
18 records- 0193US10710874B2Micromechanical structure and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 14, 2020·9 cites·21 claims
- 0285US9212045B1Micro mechanical structure and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Dec 15, 2015·6 cites·26 claims
- 0369US11787686B2Method for processing a layer structure and microelectromechanical componentINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 17, 2023·0 cites·20 claims
- 0469US11180362B2Method for processing a layer structure and microelectromechanical componentINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 23, 2021·0 cites·14 claims
- 0568US9511560B2Processing a sacrificial material during manufacture of a microfabricated productDENIFL GUENTER·Filed 2012·Granted Dec 6, 2016·3 cites·16 claims
- 0664US10081533B2Micromechanical structure and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 25, 2018·1 cites·39 claims
- 0764US8871550B2Method for processing a wafer at unmasked areas and previously masked areas to reduce a wafer thicknessGRILLE THOMAS·Filed 2012·Granted Oct 28, 2014·2 cites·25 claims
- 0863US10766766B2Method for processing a layer structure and microelectromechanical componentINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 8, 2020·0 cites·13 claims
- 0963US8125129B2Working electrode for an electrodynamic fragmenting installationMAURER DANIEL·Filed 2006·Granted Feb 28, 2012·5 cites·43 claims
- 1056US2024162296A1Semiconductor die and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1151US2023282596A1Semiconductor wafer and method for fabricating a semiconductor waferINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1249US11616032B2Semiconductor device having alignment pads and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2021·Granted Mar 28, 2023·0 cites·28 claims
- 1346US9439017B2Method for manufacturing a plurality of microphone structures, microphone and mobile deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 6, 2016·0 cites·16 claims
- 1442US2021337995A1Furniture Having an Integrated Disinfecting ChamberMAURER DANIEL·Filed 2020·Application pending·0 cites
- 1540US10106398B2Micromechanical structure comprising carbon material and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 23, 2018·0 cites·33 claims
- 1639US2014335700A1Carbon Layers for High Temperature ProcessesINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 1736US8071876B2Method for grounding a high voltage electrodeANLIKER CHRISTOPH·Filed 2006·Granted Dec 6, 2011·0 cites·27 claims
- 1834US5213183AControl device for a valve with a spiral springMECAFRANCE SA·Filed 1991·Granted May 25, 1993·8 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →