Inventor · disambiguated record
Dai Nakagawa
Also filed as: NAKAGAWA DAI
24 granted patents·10 pending applications·28 citations·filing 2008–2023
92Inventor score
Files withMURATA MANUFACTURING CO22TOYO BOSEKI4MASUDA SHIGEYOSHI2NAKAGAWA DAI2INST TECH PRECISION ELECT1
Top patents by PatentIndex Score
34 records- 0192US12250017B2Radio frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2022·Granted Mar 11, 2025·2 cites·20 claims
- 0291US12382576B2Radio-frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2023·Granted Aug 5, 2025·1 cites·17 claims
- 0391US11309925B2Radio-frequency module, transmission power amplifier, and communication apparatusMURATA MANUFACTURING CO·Filed 2021·Granted Apr 19, 2022·2 cites·20 claims
- 0490US12334898B2High frequency module and communication apparatusMURATA MANUFACTURING CO·Filed 2022·Granted Jun 17, 2025·1 cites·19 claims
- 0586US11476226B2Radio-frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2019·Granted Oct 18, 2022·5 cites·10 claims
- 0686US10964657B2Radio-frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2019·Granted Mar 30, 2021·5 cites·20 claims
- 0784US10971466B2High frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2019·Granted Apr 6, 2021·4 cites·20 claims
- 0880US10950569B2High frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2019·Granted Mar 16, 2021·3 cites·20 claims
- 0969US11239876B2High-frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2019·Granted Feb 1, 2022·1 cites·13 claims
- 1066US12438564B2Radio frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 1166US12336089B2Radio frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2023·Granted Jun 17, 2025·0 cites·12 claims
- 1265US12396090B2Radio-frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2023·Granted Aug 19, 2025·0 cites·12 claims
- 1361US9617407B2Highly insulating filmNAKAHIRO TAKASHI·Filed 2012·Granted Apr 11, 2017·1 cites·9 claims
- 1459US2024057247A1High-frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 1559US2024072838A1High-frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 1659US2024047377A1High-frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 1755US12395195B2Radio-frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2023·Granted Aug 19, 2025·0 cites·24 claims
- 1855US8179206B2Low-voltage control high-frequency switch and composite high-frequency componentNAKAGAWA DAI·Filed 2008·Granted May 15, 2012·2 cites·18 claims
- 1955US2023118132A1Radio-frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2022·Application pending·0 cites
- 2055US2010085722A1Method for mounting electronic-component module, method for manufacturing electronic apparatus using the same, and electronic-component moduleMURATA MANUFACTURING CO·Filed 2009·Application pending·0 cites
- 2155US2023328877A1High frequency module and communication apparatusMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 2253US7650692B2Method for mounting electronic-component moduleMURATA MANUFACTURING CO·Filed 2008·Granted Jan 26, 2010·0 cites·7 claims
- 2352US11448809B2Multi-layer layered filmTOYO BOSEKI·Filed 2018·Granted Sep 20, 2022·0 cites·8 claims
- 2452US2021003757A1Multilayer laminated filmTOYOBO FILM SOLUTIONS LTD·Filed 2019·Application pending·0 cites
- 2548US12001040B2Multilayer laminate filmTOYO BOSEKI·Filed 2019·Granted Jun 4, 2024·0 cites·11 claims
- 2648US12001041B2Multilayer laminate filmTOYO BOSEKI·Filed 2019·Granted Jun 4, 2024·0 cites·8 claims
- 2748US10847306B2High-frequency moduleMURATA MANUFACTURING CO·Filed 2019·Granted Nov 24, 2020·0 cites·20 claims
- 2847US12096552B2Radio frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2021·Granted Sep 17, 2024·0 cites·17 claims
- 2945US2021349249A1Multilayer laminate filmTOYO BOSEKI·Filed 2019·Application pending·0 cites
- 3043US10438746B2Insulating filmMASUDA SHIGEYOSHI·Filed 2010·Granted Oct 8, 2019·0 cites·14 claims
- 3141US10974489B2Multilayer laminated film and processed article using sameTEIJIN FILM SOLUTIONS LTD·Filed 2017·Granted Apr 13, 2021·0 cites·9 claims
- 3239US8859087B2Insulating filmMASUDA SHIGEYOSHI·Filed 2008·Granted Oct 14, 2014·1 cites·9 claims
- 3338US2015202722A1Die and method of producing dieINST TECH PRECISION ELECT·Filed 2015·Application pending·0 cites
- 3432US2014193537A1Die and method of producing dieNAKAGAWA DAI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →