Method for mounting electronic-component module, method for manufacturing electronic apparatus using the same, and electronic-component module

Abstract

A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.

1 . An electronic component module comprising:
 an electronic component base plate; and   a surface mount device mounted on the electronic component base plate via solder; wherein   at a side of a surface of the electronic component module having the surface mount device mounted thereon, a suction surface member is arranged to define a suction surface that is held with a suction head, the suction surface member being in a solid state at a location that is higher than that of an upper end of the surface mount device, and the suction surface member is vaporized, liquefied, softened, or reduced in volume at a melting temperature of the solder.   
   
   
       2 . The electronic component module according to  claim 1 , wherein a plurality of the surface mount devices are mounted on the electronic component base plate and the suction surface is disposed at a location higher than that of an upper end of a tallest surface mount device among the plurality of surface mount devices.