Inventor · disambiguated record
David O'Sullivan
Also filed as: O'SULLIVAN DAVID · O'SULLIVAN DAVID ANTHONY
8 granted patents·4 pending applications·127 citations·filing 2011–2025
85Inventor score
Top patents by PatentIndex Score
12 records- 0197US9646856B2Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chipINTEL MOBILE COMM GMBH·Filed 2015·Granted May 9, 2017·75 cites·12 claims
- 0295US9064883B2Chip with encapsulated sides and exposed surfaceMEYER THORSTEN·Filed 2011·Granted Jun 23, 2015·41 cites·7 claims
- 0379US11735570B2Fan out packaging pop mechanical attach methodINTEL CORP·Filed 2018·Granted Aug 22, 2023·2 cites·9 claims
- 0479US8786105B1Semiconductor device with chip having low-k-layersMEYER THORSTEN·Filed 2013·Granted Jul 22, 2014·5 cites·30 claims
- 0577US12243856B2Fan out packaging pop mechanical attach methodINTEL CORP·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 0672US2025167183A1Fan out packaging pop mechanical attach methodINTEL CORP·Filed 2025·Application pending·0 cites
- 0770US9111947B2Chip arrangement with a recessed chip housing region and a method for manufacturing the sameINTEL MOBILE COMM GMBH·Filed 2013·Granted Aug 18, 2015·3 cites·17 claims
- 0867US11380616B2Fan out package-on-package with adhesive die attachINTEL IP CORP·Filed 2018·Granted Jul 5, 2022·1 cites·20 claims
- 0951US2023317621A1Glass substrate package with hybrid bonded dieINTEL CORP·Filed 2022·Application pending·0 cites
- 1049US12439616B2Integrated circuit package redistribution layers with metal-insulator-metal (MIM) capacitorsINTEL CORP·Filed 2021·Granted Oct 7, 2025·0 cites·23 claims
- 1140US2020098698A1Novel wafer level chip scale package (wlcsp), flip-chip chip scale package (fccsp), and fan out shielding conceptsINTEL CORP·Filed 2018·Application pending·0 cites
- 1237US2019068941A1Method and process for transmitting a live video stream, with a 360-degree view, from the perspective of a participant in an activityOSULLIVAN DAVID ANTHONY·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →