Inventor · disambiguated record
Daisuke Ohshima
Also filed as: OHSHIMA DAISUKE
8 granted patents·4 pending applications·83 citations·filing 2006–2013
84Inventor score
Top patents by PatentIndex Score
12 records- 0195US8569892B2Semiconductor device and manufacturing method thereofMORI KENTARO·Filed 2009·Granted Oct 29, 2013·41 cites·9 claims
- 0287US8692135B2Wiring board capable of containing functional element and method for manufacturing sameFUNAYA TAKUO·Filed 2009·Granted Apr 8, 2014·25 cites·2 claims
- 0385US8766440B2Wiring board with built-in semiconductor elementKIKUCHI KATSUMI·Filed 2011·Granted Jul 1, 2014·9 cites·29 claims
- 0470US8810008B2Semiconductor element-embedded substrate, and method of manufacturing the substrateMORI KENTARO·Filed 2011·Granted Aug 19, 2014·3 cites·29 claims
- 0564US7434190B2Analysis method and analysis apparatus of designing transmission lines of an integrated circuit packaging boardNEC CORP·Filed 2006·Granted Oct 7, 2008·3 cites·18 claims
- 0663US8450843B2Semiconductor device and method for designing the sameSASAKI HIDEKI·Filed 2008·Granted May 28, 2013·2 cites·11 claims
- 0750US2014024177A1Semiconductor device and manufacturing method thereofMORI KENTARO·Filed 2013·Application pending·0 cites
- 0840US9886666B2Information processing device, information processing system, information processing method and computer-readable mediumNEC CORP·Filed 2012·Granted Feb 6, 2018·0 cites·9 claims
- 0940US8710669B2Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layerMORI KENTARO·Filed 2010·Granted Apr 29, 2014·0 cites·18 claims
- 1038US2013127037A1Semiconductor device built-in substrateMORI KENTARO·Filed 2011·Application pending·0 cites
- 1137US2013088841A1Substrate with built-in functional elementOHSHIMA DAISUKE·Filed 2011·Application pending·0 cites
- 1237US2013050967A1Functional device-embedded substrateOHSHIMA DAISUKE·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →