Inventor · disambiguated record
David Ovrutsky
Also filed as: OVRUTSKY DAVID
34 granted patents·5 pending applications·548 citations·filing 2006–2023
97Inventor score
Files withTESSERA INC9TELEDYNE FLIR COMMERCIAL SYSTEMS INC7FLIR SYSTEMS4OVRUTSKY DAVID4GRINMAN ANDREY3
Top patents by PatentIndex Score
39 records- 0199US8076788B2Off-chip vias in stacked chipsHABA BELGACEM·Filed 2010·Granted Dec 13, 2011·74 cites·17 claims
- 0299US7901989B2Reconstituted wafer level stackingTESSERA INC·Filed 2008·Granted Mar 8, 2011·128 cites·16 claims
- 0397US7935568B2Wafer-level fabrication of lidded chips with electrodeposited dielectric coatingTESSERA TECH IRELAND LTD·Filed 2006·Granted May 3, 2011·74 cites·28 claims
- 0496US7791199B2Packaged semiconductor chipsTESSERA INC·Filed 2006·Granted Sep 7, 2010·49 cites·8 claims
- 0594US8461672B2Reconstituted wafer stack packaging with after-applied pad extensionsHABA BELGACEM·Filed 2008·Granted Jun 11, 2013·27 cites·38 claims
- 0694US7936062B2Wafer level chip packagingTESSERA TECH IRELAND LTD·Filed 2007·Granted May 3, 2011·75 cites·23 claims
- 0793US7807508B2Wafer-level fabrication of lidded chips with electrodeposited dielectric coatingTESSERA TECH HUNGARY KFT·Filed 2007·Granted Oct 5, 2010·62 cites·21 claims
- 0889US8189277B2Recessed optical surfacesKINTZ GREGORY J·Filed 2011·Granted May 29, 2012·13 cites·25 claims
- 0988US7749886B2Microelectronic assemblies having compliancy and methods thereforTESSERA INC·Filed 2006·Granted Jul 6, 2010·13 cites·34 claims
- 1082US8476774B2Off-chip VIAS in stacked chipsHABA BELGACEM·Filed 2011·Granted Jul 2, 2013·4 cites·5 claims
- 1179US9899353B2Off-chip vias in stacked chipsTESSERA INC·Filed 2015·Granted Feb 20, 2018·2 cites·17 claims
- 1279US8885257B2Focus compensation for optical elements and applications thereofOVRUTSKY DAVID·Filed 2010·Granted Nov 11, 2014·6 cites·10 claims
- 1378US9548254B2Packaged semiconductor chips with arrayTESSERA INC·Filed 2015·Granted Jan 17, 2017·2 cites·15 claims
- 1478US8687294B2Recessed optical surfacesKINTZ GREGORY J·Filed 2012·Granted Apr 1, 2014·4 cites·14 claims
- 1578US8653644B2Packaged semiconductor chips with arrayGRINMAN ANDREY·Filed 2012·Granted Feb 18, 2014·4 cites·60 claims
- 1675US9048234B2Off-chip vias in stacked chipsTESSERA INC·Filed 2013·Granted Jun 2, 2015·2 cites·15 claims
- 1775US8422138B2Wafer level optical elements and applications thereofOVRUTSKY DAVID·Filed 2009·Granted Apr 16, 2013·2 cites·15 claims
- 1871US8115308B2Microelectronic assemblies having compliancy and methods thereforOGANESIAN VAGE·Filed 2010·Granted Feb 14, 2012·2 cites·19 claims
- 1967US11063159B2Methods for routing electrical interconnections and resultant structuresFLIR SYSTEMS·Filed 2019·Granted Jul 13, 2021·1 cites·20 claims
- 2067US10818550B2Methods for singulation and packagingFLIR SYSTEMS·Filed 2017·Granted Oct 27, 2020·1 cites·20 claims
- 2164US12389090B2Imager optical systems and methodsTELEDYNE FLIR COMMERCIAL SYSTEMS INC·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 2261US9910239B2Wafer level optical elements and applications thereofOVRUTSKY DAVID·Filed 2010·Granted Mar 6, 2018·1 cites·23 claims
- 2360US9030745B2Wafer level optical elements and applications thereofOVRUTSKY DAVID·Filed 2013·Granted May 12, 2015·0 cites·18 claims
- 2459US2024168268A1Athermalized lens systems and methodsTELEDYNE FLIR COMMERCIAL SYSTEMS INC·Filed 2023·Application pending·0 cites
- 2558US8053281B2Method of forming a wafer level packageTESSERA INC·Filed 2008·Granted Nov 8, 2011·1 cites·13 claims
- 2657US10409041B2TIR imaging lens, image capturing system having the same, and associated methodsFLIR SYSTEMS·Filed 2018·Granted Sep 10, 2019·0 cites·25 claims
- 2757US9070678B2Packaged semiconductor chips with arrayTESSERA INC·Filed 2014·Granted Jun 30, 2015·0 cites·19 claims
- 2855US12393021B2Optical components for ghost image suppression systems and methodsTELEDYNE FLIR COMMERCIAL SYSTEMS INC·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 2955US2024126147A1Heated cameras and related methodsTELEDYNE FLIR COMMERCIAL SYSTEMS INC·Filed 2023·Application pending·0 cites
- 3054US8848301B2Focus compensation for optical elements and applications thereofWELCH WILLIAM HUDSON·Filed 2010·Granted Sep 30, 2014·1 cites·28 claims
- 3154US2023051264A1Superhydrophobic surface in thermal infrared imaging deviceTELEDYNE FLIR COMMERCIAL SYSTEMS INC·Filed 2022·Application pending·0 cites
- 3252US8759973B2Microelectronic assemblies having compliancy and methods thereforOGANESIAN VAGE·Filed 2011·Granted Jun 24, 2014·0 cites·20 claims
- 3351US8883562B2Reconstituted wafer stack packaging with after-applied pad extensionsTESSERA INC·Filed 2013·Granted Nov 11, 2014·0 cites·18 claims
- 3449US8569876B2Packaged semiconductor chips with arrayGRINMAN ANDREY·Filed 2006·Granted Oct 29, 2013·0 cites·94 claims
- 3546US12345862B2Wide field of view imaging systems and methodsTELEDYNE FLIR COMMERCIAL SYSTEMS INC·Filed 2021·Granted Jul 1, 2025·0 cites·20 claims
- 3646US2015109456A1Tir imaging lens, image capturing system having the same, and associated methodsFLIR SYSTEMS·Filed 2015·Application pending·0 cites
- 3744US8704347B2Packaged semiconductor chipsGRINMAN ANDREY·Filed 2010·Granted Apr 22, 2014·0 cites·20 claims
- 3841US11982797B2Aspect ratio modifying imaging systems and methodsTELEDYNE FLIR COMMERCIAL SYSTEMS INC·Filed 2020·Granted May 14, 2024·0 cites·20 claims
- 3940US2007190747A1Wafer level packaging to lidded chipsTESSERA TECH HUNGARY KFT·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →