Inventor · disambiguated record
David Pays-Volard
Also filed as: PAYS-VOLARD DAVID
27 granted patents·73 citations·filing 2012–2022
95Inventor score
Technology areasH10P
Top patents by PatentIndex Score
27 records- 0195US8802545B2Method and apparatus for plasma dicing a semi-conductor waferJOHNSON CHRIS·Filed 2012·Granted Aug 12, 2014·15 cites·5 claims
- 0295US8785332B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Jul 22, 2014·15 cites·2 claims
- 0393US8778806B2Method and apparatus for plasma dicing a semi-conductor waferJOHNSON CHRIS·Filed 2012·Granted Jul 15, 2014·10 cites·12 claims
- 0491US9711406B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA-THERM LLC·Filed 2016·Granted Jul 18, 2017·6 cites·7 claims
- 0591US8691702B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Apr 8, 2014·13 cites·6 claims
- 0683US9070760B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Jun 30, 2015·3 cites·21 claims
- 0780US8796154B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Aug 5, 2014·2 cites·11 claims
- 0877US9911654B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2016·Granted Mar 6, 2018·1 cites·8 claims
- 0976US9564366B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA-THERM LLC·Filed 2015·Granted Feb 7, 2017·1 cites·3 claims
- 1075US9082839B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2014·Granted Jul 14, 2015·3 cites·14 claims
- 1173US8980764B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Mar 17, 2015·1 cites·5 claims
- 1272US9105705B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Aug 11, 2015·1 cites·26 claims
- 1369US9343365B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted May 17, 2016·2 cites·9 claims
- 1468US11488865B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2019·Granted Nov 1, 2022·0 cites·8 claims
- 1567US10707060B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2018·Granted Jul 7, 2020·0 cites·12 claims
- 1665US10741447B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA-THERM LLC·Filed 2018·Granted Aug 11, 2020·0 cites·14 claims
- 1762US12489018B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2022·Granted Dec 2, 2025·0 cites·8 claims
- 1861US10297427B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2015·Granted May 21, 2019·0 cites·6 claims
- 1961US9202721B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2014·Granted Dec 1, 2015·0 cites·7 claims
- 2060US9202720B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Dec 1, 2015·0 cites·5 claims
- 2159US9496177B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA-THERM LLC·Filed 2015·Granted Nov 15, 2016·0 cites·6 claims
- 2258US10573557B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2015·Granted Feb 25, 2020·0 cites·7 claims
- 2353US8946058B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Feb 3, 2015·0 cites·42 claims
- 2449US9368404B2Method for dicing a substrate with back metalPLASMA THERM LLC·Filed 2013·Granted Jun 14, 2016·0 cites·15 claims
- 2548US10497621B2Method for dicing a substrate with back metalPLASMA THERM LLC·Filed 2016·Granted Dec 3, 2019·0 cites·13 claims
- 2648US9202737B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2015·Granted Dec 1, 2015·0 cites·7 claims
- 2741USRE46339EMethod and apparatus for plasma dicing a semi-conductor waferPLASMA-THERM LLC·Filed 2015·Granted Mar 14, 2017·0 cites·42 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →