Inventor · disambiguated record
David Schroeder
Also filed as: SCHROEDER DAVID · SCHROEDER DAVID J
11 granted patents·4 pending applications·255 citations·filing 2000–2010
91Inventor score
Top patents by PatentIndex Score
15 records- 0192US6936543B2CMP method utilizing amphiphilic nonionic surfactantsCABOT MICROELECTRONICS CORP·Filed 2002·Granted Aug 30, 2005·82 cites·30 claims
- 0290US6821897B2Method for copper CMP using polymeric complexing agentsCABOT MICROELECTRONICS CORP·Filed 2002·Granted Nov 23, 2004·60 cites·30 claims
- 0384US6726534B1Preequilibrium polishing method and systemCABOT MICROELECTRONICS CORP·Filed 2002·Granted Apr 27, 2004·39 cites·45 claims
- 0483US7091604B2Three dimensional integrated circuitsCABOT MICROELECTRONICS CORP·Filed 2004·Granted Aug 15, 2006·35 cites·20 claims
- 0576US6612911B2Alkali metal-containing polishing system and methodCABOT MICROELECTRONICS CORP·Filed 2002·Granted Sep 2, 2003·11 cites·48 claims
- 0672US7485241B2Chemical-mechanical polishing composition and method for using the sameCABOT MICROELECTRONICS CORP·Filed 2003·Granted Feb 3, 2009·13 cites·36 claims
- 0769US8529680B2Compositions for CMP of semiconductor materialsDE REGE THESAURO FRANCESCO·Filed 2010·Granted Sep 10, 2013·2 cites·25 claims
- 0864US7238618B2System for the preferential removal of silicon oxideCABOT MICROELECTRONICS CORP·Filed 2003·Granted Jul 3, 2007·9 cites·15 claims
- 0962US7803203B2Compositions and methods for CMP of semiconductor materialsCABOT MICROELECTRONICS CORP·Filed 2007·Granted Sep 28, 2010·1 cites·25 claims
- 1054US7754098B2Chemical-mechanical polishing composition and method for using the sameCABOT MICROELECTRONICS CORP·Filed 2004·Granted Jul 13, 2010·3 cites·13 claims
- 1151US2010119810A1Compositionally uniform, multi-layer, group vb, hydrogen transport membraneGAS TECHNOLOGY INST·Filed 2008·Application pending·0 cites
- 1250US7365013B2System for the preferential removal of silicon oxideCABOT MICROELECTRONICS CORP·Filed 2007·Granted Apr 29, 2008·0 cites·31 claims
- 1339US2002197935A1Method of polishing a substrateFiled 2000·Application pending·0 cites
- 1437US2005263407A1Electrochemical-mechanical polishing composition and method for using the sameCABOT MICROELECTRONICS CORP·Filed 2004·Application pending·0 cites
- 1532US2001037821A1Integrated chemical-mechanical polishingFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →