Inventor · disambiguated record
David Shia
Also filed as: SHIA DAVID
37 granted patents·36 pending applications·252 citations·filing 2001–2025
96Inventor score
Top patents by PatentIndex Score
73 records- 0193US7042727B2Heat sink mounting and interface mechanism and method of assembling sameINTEL CORP·Filed 2003·Granted May 9, 2006·90 cites·9 claims
- 0292US10595439B2Movable heatsink utilizing flexible heat pipesINTEL CORP·Filed 2018·Granted Mar 17, 2020·7 cites·19 claims
- 0388US12057370B2Vacuum modulated two phase cooling loop efficiency and parallelism enhancementINTEL CORP·Filed 2020·Granted Aug 6, 2024·2 cites·13 claims
- 0488US11449111B2Scalable, high load, low stiffness, and small footprint loading mechanismINTEL CORP·Filed 2018·Granted Sep 20, 2022·6 cites·15 claims
- 0588US6542367B2Securing heat sinksINTEL CORP·Filed 2001·Granted Apr 1, 2003·47 cites·9 claims
- 0686US6522545B2Securing heat sinksINTEL CORP·Filed 2002·Granted Feb 18, 2003·38 cites·9 claims
- 0784US8710858B2Micro positioning test socket and methods for active precision alignment and co-planarity feedbackDETOFSKY ABRAM M·Filed 2010·Granted Apr 29, 2014·7 cites·14 claims
- 0882US9366482B2Adjustable heat pipe thermal unitINTEL CORP·Filed 2012·Granted Jun 14, 2016·5 cites·20 claims
- 0981US12490410B2Circuit devices integrated with boiling enhancement for two-phase immersion coolingINTEL CORP·Filed 2021·Granted Dec 2, 2025·1 cites·20 claims
- 1081US12133357B2Cold plate architecture for liquid cooling of devicesINTEL CORP·Filed 2020·Granted Oct 29, 2024·1 cites·20 claims
- 1179US2025071938A1Cold plate architecture for liquid cooling of devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 1277US12293956B2Boiling enhancement structures for immersion cooled electronic systemsINTEL CORP·Filed 2021·Granted May 6, 2025·1 cites·24 claims
- 1377US10677845B2Converged test platforms and processes for class and system testing of integrated circuitsINTEL CORP·Filed 2017·Granted Jun 9, 2020·2 cites·28 claims
- 1476US12131977B2Electronic systems with inverted circuit board with heat sink to chassis attachmentINTEL CORP·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 1575US9255945B2Micro positioning test socket and methods for active precision alignment and co-planarity feedbackINTEL CORP·Filed 2014·Granted Feb 9, 2016·2 cites·6 claims
- 1674US7161238B2Structural reinforcement for electronic substrateINTEL CORP·Filed 2002·Granted Jan 9, 2007·17 cites·27 claims
- 1771US12500137B2Directly impinging pressure modulated spray cooling and methods of target temperature controlINTEL CORP·Filed 2023·Granted Dec 16, 2025·0 cites·5 claims
- 1870US6519153B1Heat sink retention frameINTEL CORP·Filed 2001·Granted Feb 11, 2003·17 cites·21 claims
- 1968US8797053B2Positioning and socketing for semiconductor diceRUTIGLIANO MICHAEL L·Filed 2011·Granted Aug 5, 2014·3 cites·21 claims
- 2067US9977054B2Etching for probe wire tips for microelectronic device testINTEL CORP·Filed 2015·Granted May 22, 2018·1 cites·21 claims
- 2166US2025234478A1Patterned bolster plate and composite back plate for semiconductor chip lga package and cooling assembly retentionINTEL CORP·Filed 2025·Application pending·0 cites
- 2265US12453054B2Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling massINTEL CORP·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 2365US12262478B2Selectively applied protective layer on exposed materials of electronic circuit board and electronic components disposed thereon for immersion bath cooled systemsINTEL CORP·Filed 2021·Granted Mar 25, 2025·0 cites·18 claims
- 2464US12063759B2Conformable cold plate for fluid cooling applicationsINTEL CORP·Filed 2020·Granted Aug 13, 2024·0 cites·20 claims
- 2564US9069014B2Wire probe assembly and forming process for die testingALBERTSON TODD P·Filed 2012·Granted Jun 30, 2015·2 cites·17 claims
- 2663US12279395B2Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retentionINTEL CORP·Filed 2021·Granted Apr 15, 2025·0 cites·14 claims
- 2763US11842943B2Electronic systems with inverted circuit board with heat sink to chassis attachmentINTEL CORP·Filed 2020·Granted Dec 12, 2023·0 cites·22 claims
- 2862US9354273B2Composite wire probe test assemblyINTEL CORP·Filed 2012·Granted May 31, 2016·1 cites·11 claims
- 2961US9134343B2Sort probe gripperSHIA DAVID·Filed 2012·Granted Sep 15, 2015·1 cites·18 claims
- 3061US2025089192A1Composite backplate architectures for backside power delivery and associated methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 3160US2025024593A1Apparatus and systems to retain a printed circuit board between mounting platesGENG PHIL·Filed 2024·Application pending·0 cites
- 3259US2025291134A1Optical connectors with alignment featuresINTEL CORP·Filed 2024·Application pending·0 cites
- 3359US2025291126A1Optical connectors with integrated optical isolatorsINTEL CORP·Filed 2024·Application pending·0 cites
- 3459US2025071924A1Tall DIMM Structural RetentionINTEL CORP·Filed 2024·Application pending·0 cites
- 3558US12442712B2Liquid cooling system leak detection improvementsINTEL CORP·Filed 2020·Granted Oct 14, 2025·0 cites·15 claims
- 3658US2024133945A1Modular low level contact resistance testing apparatus for processor socketsPRABHUGOUD MOHANRAJ·Filed 2023·Application pending·0 cites
- 3757US2024096741A1Cooling systems with main and remote cooling masses having integrated flexibilityINTEL CORP·Filed 2023·Application pending·0 cites
- 3855US2023038805A1Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 3955US2024179832A1Multi-entry socket power delivery structure and backplateGENG PHIL·Filed 2024·Application pending·0 cites
- 4054US12315780B2Technologies for processor loading mechanismsINTEL CORP·Filed 2021·Granted May 27, 2025·0 cites·10 claims
- 4154US12309966B2Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading forceINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·17 claims
- 4254US11976671B2Vacuum modulated two phase cooling loop performance enhancementINTEL CORP·Filed 2020·Granted May 7, 2024·0 cites·14 claims
- 4354US2025102745A1Robust waveguide alignment mechanismINTEL CORP·Filed 2023·Application pending·0 cites
- 4454US2021351106A1Directly impinging pressure modulated spray cooling and methods of target temperature controlINTEL CORP·Filed 2020·Application pending·0 cites
- 4553US12309933B2Magnetically secured semiconductor chip package loading assemblyINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·20 claims
- 4653US12248344B2Technologies for liquid cooling interfacesINTEL CORP·Filed 2021·Granted Mar 11, 2025·0 cites·25 claims
- 4753US2023022058A1Back plates to support integrated circuit packages in sockets on printed circuit boards and associated methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 4853US2024094476A1Technologies for a pluggable optical connectorINTEL CORP·Filed 2022·Application pending·0 cites
- 4953US2023395460A1Backside integrated torsion loading mechanismINTEL CORP·Filed 2023·Application pending·0 cites
- 5053US2024240688A1Mitigation of seismic event effects on liquid immersion cooling systemsGENG PHIL·Filed 2024·Application pending·0 cites
Showing the top 50 of 73 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →