Directly impinging pressure modulated spray cooling and methods of target temperature control

Abstract

Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

What is claimed is: 
     
         1 . A thermal testing unit, comprising:
 a nozzle frame;   a nozzle plate within the frame, wherein the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate; and   a housing attached to the nozzle plate.   
     
     
         2 . The thermal testing unit of  claim 1 , wherein individual ones of the plurality of orifices have a uniform diameter through the thickness of the nozzle plate. 
     
     
         3 . The thermal testing unit of  claim 1 , wherein individual ones of the plurality of orifices have a tapered diameter, wherein a first diameter on an upstream side of the nozzle plate is greater than a second diameter on a downstream side of the nozzle plate. 
     
     
         4 . The thermal testing unit of  claim 1 , wherein the plurality of orifices comprises a first group of orifices and a second group of orifices. 
     
     
         5 . The thermal testing unit of  claim 4 , wherein the first group of orifices are positioned within a first recess, and wherein the second group of orifices are positioned within a second recess. 
     
     
         6 . The thermal testing unit of  claim 1 , wherein the nozzle plate is displaceable relative to the housing. 
     
     
         7 . The thermal testing unit of  claim 6 , further comprising a lead screw attached between the housing and the nozzle plate. 
     
     
         8 . The thermal testing unit of  claim 1 , further comprising:
 a sealant plate between the housing and the nozzle frame.   
     
     
         9 . The thermal testing unit of  claim 1 , wherein a downstream side of the nozzle frame comprises a first groove for securing a first gasket against a substrate, and a second groove for securing a second gasket against the substrate. 
     
     
         10 . The thermal testing unit of  claim 1 , wherein the nozzle frame comprises an opening that fluidically couples a downstream side of the nozzle frame to a fluid output line in the housing. 
     
     
         11 . The thermal testing unit of  claim 1 , further comprising:
 a second nozzle plate within the nozzle frame, wherein the nozzle plate is displaceable with respect to the second nozzle plate.   
     
     
         12 . An electronic package, comprising:
 a package substrate;   a die attached to the package substrate;   a spray chamber over the die, wherein the spray chamber comprises:
 a fluid inlet; 
 a nozzle fluidically coupled to the fluid inlet, wherein the nozzle directs a fluid towards a surface of the die; and 
 a vapor exit port; and 
   a vacuum pump fluidically coupled to the vapor exit port.   
     
     
         13 . The electronic package of  claim 12 , further comprising:
 a plurality of nozzles fluidically coupled to the fluid inlet.   
     
     
         14 . The electronic package of  claim 12 , wherein the spray chamber is attached to the package substrate. 
     
     
         15 . The electronic package of  claim 12 , further comprising:
 a thermal interface material (TIM) over the die; and   a thermal plate over the TIM.   
     
     
         16 . The electronic package of  claim 15 , wherein the spray chamber is attached to the thermal plate. 
     
     
         17 . The electronic package of  claim 12 , wherein the spray chamber further comprises:
 a liquid exit port.   
     
     
         18 . A temperature control system, comprising:
 a fluid reservoir for holding a fluid;   a spray chamber fluidically coupled to the fluid reservoir;   a pump between the spray chamber and the fluid reservoir, wherein the pump provides the fluid to the spray chamber;   a vacuum pump fluidically coupled to the spray chamber, wherein the vacuum pump controls a pressure within the spray chamber; and   a pressure regulator that controls the vacuum pump.   
     
     
         19 . The temperature control system of  claim 18 , wherein a die is thermally coupled to the spray chamber. 
     
     
         20 . The temperature control system of  claim 19 , wherein the die is within the spray chamber. 
     
     
         21 . The temperature control system of  claim 19 , further comprising a thermal plate between the spray chamber and the die. 
     
     
         22 . The temperature control system of  claim 18 , wherein the fluid reservoir comprises:
 a heating element; and   a cooling element.   
     
     
         23 . An electronic system, comprising:
 a board;   a package substrate attached to the board;   a die attached to the package substrate;   a spray chamber over the die, wherein the spray chamber comprises:
 a fluid inlet; 
 a nozzle fluidically coupled to the fluid inlet, wherein the nozzle directs a fluid towards a surface of the die; and 
 a vapor exit port; and 
   a vacuum pump fluidically coupled to the vapor exit port.   
     
     
         24 . The electronic system of  claim 23 , wherein the spray chamber is attached to the package substrate. 
     
     
         25 . The electronic system of  claim 23 , further comprising:
 a thermal interface material (TIM) over the die; and   a thermal plate over the TIM.